Abstract: Systems and methods are disclosed for the disassembly and preferably reassembly of semiconductor device packages. A method of the invention includes steps for excavating a portion of a semiconductor device package to expose a target surface within the interior of the package. The technique further includes steps of focusing a laser at a selected distance from the target surface in order to ablate the package material, exposing the target surface. Preferred embodiments of the invention are disclosed in which a cavity is excavated through the package to expose portions of leadfingers within. A temporary chip mount plate is affixed to an exterior surface of the package to cover one side of the cavity. A chip is attached to the temporary chip mount plate where it is electrically coupled to the leadfingers in the interior of the package. The contents of the cavity are then encapsulated with dielectric mold compound and the temporary chip mount plate is preferably removed to expose the backside of the chip.