Patents by Inventor Derek Lieber

Derek Lieber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080059676
    Abstract: Embodiments of the present invention provide techniques for protecting critical sections of code being executed in a lightweight kernel environment suited for use on a compute node of a parallel computing system. These techniques avoid the overhead associated with a full kernel mode implementation of a network layer, while also allowing network interrupts to be processed without corrupting shared memory state. In one embodiment, a fast user-space function sets a flag in memory indicating that interrupts should not progress and also provides a mechanism to defer processing of the interrupt.
    Type: Application
    Filed: August 31, 2006
    Publication date: March 6, 2008
    Inventors: Charles Jens Archer, Michael Alan Blocksome, Todd Alan Inglett, Derek Lieber, Patrick Joseph McCarthy, Michael Basil Mundy, Jeffrey John Parker, Joseph D. Ratterman, Brian Edward Smith
  • Publication number: 20080059677
    Abstract: Embodiments of the present invention provide techniques for protecting critical sections of code being executed in a lightweight kernel environment suited for use on a compute node of a parallel computing system. These techniques avoid the overhead associated with a full kernel mode implementation of a network layer, while also allowing network interrupts to be processed without corrupting shared memory state. In one embodiment, a system call may be used to disable interrupts upon entry to a routine configured to process an event associated with the interrupt.
    Type: Application
    Filed: August 31, 2006
    Publication date: March 6, 2008
    Inventors: Charles Jens Archer, Michael Alan Blocksome, Todd Alan Inglett, Derek Lieber, Patrick Joseph McCarthy, Michael Basil Mundy, Jeffrey John Parker, Joseph D. Ratterman, Brian Edward Smith
  • Patent number: 6182281
    Abstract: An enhanced compiler for compiling C++ programs without the use of forward declarations normally included in program header files. Through multiple parsing passes, the compiler extracts definitions for the declarations directly from the bodies of the C++ files. By saving the definitions to a persistent program representation, for example a program database, on subsequent sweeps, only definitions for new or changed declarations need be updated. In this way, C++ programs can be incrementally compiled on a declaration by declaration basis.
    Type: Grant
    Filed: April 16, 1997
    Date of Patent: January 30, 2001
    Assignee: International Business Machines Corporation
    Inventors: Lee Richard Nackman, Michael Karasick, John Joseph Barton, Derek Lieber, David Joseph Streeter
  • Patent number: 4245189
    Abstract: An improved probe assembly for measuring the conductivity of a plated through hole in a circuit board. The probe assembly having a longitudinal housing and including at the forward end thereof a segmented current injection electrode, each segment being spring biased forwardly and capable of independent movement longitudinally with respect to the housing between a forward position and rearward position. The segmented current injection electrode injecting current into the through hole substantially 360.degree. of the circular edge formed by the intersection of the walls defining the through hole and the surface of the circuit board. A voltage measurement electrode being a knife-blade electrode is positioned in the interstices between the segments of the current injection electrode. The voltage measurement electrode also being spring biased in a forward direction and capable of longitudinal movement between a forward position and a rearward position.
    Type: Grant
    Filed: June 14, 1979
    Date of Patent: January 13, 1981
    Assignee: UPA Technology, Inc.
    Inventors: Robert O. Wahl, Derek Lieber, Jay M. Lesser
  • Patent number: 4229652
    Abstract: A backscatter measurement device for measuring the thickness of a coating on a strip of substrate material moving from a feed supply to a take up location at a predetermined speed. A measurement wheel is provided on the rim of which are mouted backscatter probes for irradiating and detecting the backscattered radiation from the coated substrate. The coated strip of substrate material is threaded around the outer surface of the rim. The measurement wheel is rotated at a speed such that the tangential speed of a point on the rim equals the speed of the moving strip whereby the probe and an adjacent point on the strip are stationary relative to one another while the point on the strip is adjacent the rim. Thus thickness measurements may be taken without stopping the movement of the coated strip.
    Type: Grant
    Filed: June 2, 1978
    Date of Patent: October 21, 1980
    Assignee: Unit Process Assemblies, Inc.
    Inventors: Jacques Weinstock, Derek Lieber, William D. Hay
  • Patent number: 4190770
    Abstract: A backscatter measurement device for measuring the thickness of a coating on elements forming a web of substrate material moving from a feed supply to a take-up location at a predetermined speed. A measurement wheel is provided, adjacent to the rim of which is mounted a backscatter probe for irradiating and detecting the backscattered radiation from a coated substrate. The web of substrate material is threaded around the outer surface of the rim. The measurement wheel is rotated at a speed such that the tangential speed of a point on the rim equals the speed of the moving web whereby the probe and an adjacent point on the web are stationary relative to one another while the point on the web is adjacent the rim. Thus thickness measurements may be taken without stopping the movement of the coated web. This backscatter measurement device is further provided with indexing apparatus to position automatically the probe directly adjacent an element to be measured on the web.
    Type: Grant
    Filed: November 15, 1977
    Date of Patent: February 26, 1980
    Assignee: Unit Process Assemblies, Inc.
    Inventors: James Saunders, William D. Hay, Jacques Weinstock, Derek Lieber
  • Patent number: 4155009
    Abstract: An improved backscatter instrument for the nondestructive measurement of coatings on a substrate. A memory having selectable memory areas, each area having stored intelligence available which is determinative of the shape of a functional plot of coating thickness versus backscatter counts per minute unique for each particular combination of emitting isotope, substrate material, coating material and physical characteristics of the measuring instrument. A memory selector switch connects a selected area of memory to a microprocessor operating under program control whereby the microprocessor reads the intelligence stored at the selected area and converts the backscattered count of the coating being measured into indicia of coating thickness.
    Type: Grant
    Filed: April 7, 1977
    Date of Patent: May 15, 1979
    Assignee: Unit Process Assemblies, Inc.
    Inventors: Sidney Lieber, Julius Schlesinger, Derek Lieber, Alfred Baker
  • Patent number: 4115690
    Abstract: A backscatter measurement device for measuring the thickness of a coating on a strip of substrate material moving from a feed supply to a take up location at a predetermined speed. A measurement wheel is provided on the rim of which are mounted backscatter probes for irradiating and detecting the backscattered radiation from the coated substrate. The coated strip of substrate material is threaded around the outer surface of the rim. The measurement wheel is rotated at a speed such that the tangential speed of a point on the rim equals the speed of the moving strip whereby the probe and an adjacent point on the strip are stationary relative to one another while the point on the strip is adjacent the rim. Thus thickness measurements may be taken without stopping the movement of the coated strip.
    Type: Grant
    Filed: June 3, 1977
    Date of Patent: September 19, 1978
    Assignee: Unit Process Assemblies, Inc.
    Inventors: Jacques Weinstock, Derek Lieber, William Dunning Hay