Abstract: A modular flooring system comprises a modular floor surface and a plurality of stackable, three-dimensional modular interior design components (MIDCs). The modular floor surface can comprise an array of discrete, raised, low-profile, receiving panels that can be rectangular in shape. MIDCs can be securely and interchangeably placed on any group of one or more adjacent unoccupied receiving panel and they can also be stackable, such that various different floor layouts can be created. Each of the MIDCs may comprise a lower surface recess that fits over a group of one or more adjacent raised receiving panels. A first MIDC may have an raised lip on a top surface such that the lower surface recess of a second MIDC fits over, separately and interchangeably, one (or more) of the raised receiving panels and the raised lip on the top surface of the first MIDC.

Abstract: A modular flooring system comprises a modular floor surface and a plurality of stackable, three-dimensional modular interior design components (MIDCs). The modular door surface can comprise an array of discrete, raised, low-profile, receiving panels that can be rectangular in shape. MIDCs can be securely and interchangeably placed on any group of one or more adjacent unoccupied receiving panel and they east also be stackable, such that various different floor layouts can be created. Bach of the MIDCs may comprise a lower surface recess that fits over a group of one or more adjacent raised receiving panels. A first MIDC may have an raised lip on a top surface such that the lower surface recess of a second MIDC fits over, separately and interchangeably, one (or more) of the raised receiving panels and the raised lip on the top surface of the first MIDC.

Abstract: A modular flooring system comprises a modular floor surface and a plurality of stackable, three-dimensional modular interior design components (MIDCs). The modular door surface can comprise an array of discrete, raised, low-profile, receiving panels that can be rectangular in shape. MIDCs can be securely and interchangeably placed on any group of one or more adjacent unoccupied receiving panel and they east also be stackable, such that various different floor layouts can be created. Bach of the MIDCs may comprise a lower surface recess that fits over a group of one or more adjacent raised receiving panels. A first MIDC may have an raised lip on a top surface such that the lower surface recess of a second MIDC fits over, separately and interchangeably, one (or more) of the raised receiving panels and the raised lip on the top surface of the first MIDC.

Abstract: A modular flooring system comprises a modular floor surface and a plurality of stackable, three-dimensional modular interior design components (MIDCs). The modular floor surface can comprise an array of discrete, raised, low-profile, receiving panels that can be rectangular in shape. MIDCs can be securely and interchangeably placed on any group of one or more adjacent unoccupied receiving panel and they can also be stackable, such that various different floor layouts can be created. Each of the MIDCs may comprise a lower surface recess that fits over a group of one or more adjacent raised receiving panels. A first MIDC may have an raised lip on a top surface such that the lower surface recess of a second MIDC fits over, separately and interchangeably, one (or more) of the raised receiving panels and the raised lip on the top surface of the first MIDC.

Abstract: A modular flooring system comprises a modular floor surface and a plurality of stackable, three-dimensional modular interior design components (MIDCs). The modular floor surface can comprise an array of discrete, raised, low-profile, receiving panels that can be rectangular in shape. MIDCs can be securely and interchangeably placed on any group of one or more adjacent unoccupied receiving panel and they can also be stackable, such that various different floor layouts can be created. Each of the MIDCs may comprise a lower surface recess that fits over a group of one or more adjacent raised receiving panels. A first MIDC may have an raised lip on a top surface such that the lower surface recess of a second MIDC fits over, separately and interchangeably, one (or more) of the raised receiving panels and the raised lip on the top surface of the first MIDC.

Abstract: A modular flooring system comprises a modular floor surface and a plurality of stackable, three-dimensional modular interior design components (MIDCs). The modular floor surface can comprise an array of discrete, raised, low-profile, receiving panels that can be rectangular in shape. MIDCs can be securely and interchangeably placed on any group of one or more adjacent unoccupied receiving panel and they can also be stackable, such that various different floor layouts can be created. Each of the MIDCs may comprise a lower surface recess that fits over a group of one or more adjacent raised receiving panels. A first MIDC may have an raised lip on a top surface such that the lower surface recess of a second MIDC fits over, separately and interchangeably, one (or more) of the raised receiving panels and the raised lip on the top surface of the first MIDC.

Abstract: A shock absorber assembly for protecting a portable electronic device includes a number of protective elements disposed about the periphery of the portable electronic device. The protective elements are coupled to one another by an adjustable tension cord received through a passage in each of the protective elements. The adjustable tension cord is engaged with a fastener that is configured to be positioned in a secured position in which the tension of the adjustable tension cord is not adjustable and an adjustable position in which the tension of the adjustable tension cord may be adjusted by the user by moving the fastener with respect to the adjustable tension cord. The protective assembly is configured to protect the device from shocks and to elevate the device above a support surface to protect it from contact with moisture on the support surface.