Abstract: In some embodiments, circuits for ultrasonic transducer element arrays are provided. In some embodiments, a circuit described herein comprises a first layer for receiving a transducer element array, a ground layer comprising at least one ground disposed over the first layer and a plurality of first vias corresponding to transducer elements of the array, the first vias extending through the first layer to the at least one ground and comprising first ends for receiving ground electrodes of the transducer elements and second ends electrically connected to the ground.

Abstract: In some embodiments, circuits for ultrasonic transducer element arrays are provided. In some embodiments, a circuit described herein comprises a first layer for receiving a transducer element array, a ground layer comprising at least one ground disposed over the first layer and a plurality of first vias corresponding to transducer elements of the array, the first vias extending through the first layer to the at least one ground and comprising first ends for receiving ground electrodes of the transducer elements and second ends electrically connected to the ground.

Abstract: In a method of making an ultrasonic transducer, a piezoelectric ceramic material that is at least partially covered by metal plating is provided. A plurality of substantially parallel cuts is formed in the plating so as to define a plurality of transducer elements and a ground element. A plurality of conductors is provided. An end portion of each conductor is operatively connected, such as by ultrasonic bonding, to a respective one of the transducer elements or the ground element. Next, a backing material is bonded to the plurality of transducer elements and the ground element such that the end portion of each conductor is sandwiched between the backing material and a respective one of the transducer elements or the ground element. The conductors are bent to allow for operative connection to an ultrasound system. The operative connection between the conductors and the transducer elements is maintained during the bending step.

Abstract: In one aspect, testing apparatus for ultrasound transducers comprising arrays of transducing elements are described herein. In some embodiments, a test apparatus for an ultrasound transducer having a curved transducing element array comprises a block of material permitting propagation of an acoustic signal generated by the transducer, the block of material comprising a transducer receiving surface and a second surface in facing opposition to the receiving surface and forming an acoustically reflective interface with a medium, the second surface comprising a curvature having a center similar to or substantially similar to the center of curvature of the transducer element array when the transducer is coupled to the receiving surface.

Abstract: A transducer system includes a multi-layer flexible circuit. The flexible circuit includes a first layer, a second layer and a third layer. The circuit engages a piezoelectric material/electrode subassembly. Vias are used to operatively connect ground electrodes of individual transducer elements to grounds in the third layer of the circuit. The vias extend through the first and second layers to the third layer of the circuit. When the flexible circuit is diced during the assembly of the transducer system, no cuts are made in the third layer of the circuit. As a result, a common ground connection is maintained by way of the grounds in the third layer of the circuit. Thus, no subsequent operation of reconnecting the common ground electrode is required.

Abstract: In a method of making an ultrasonic transducer, a piezoelectric ceramic material that is at least partially covered by metal plating is provided. A plurality of substantially parallel cuts is formed in the plating so as to define a plurality of transducer elements and a ground element. A plurality of conductors is provided. An end portion of each conductor is operatively connected, such as by ultrasonic bonding, to a respective one of the transducer elements or the ground element. Next, a backing material is bonded to the plurality of transducer elements and the ground element such that the end portion of each conductor is sandwiched between the backing material and a respective one of the transducer elements or the ground element. The conductors are bent to allow for operative connection to an ultrasound system. The operative connection between the conductors and the transducer elements is maintained during the bending step.

Abstract: A transducer system includes a multi-layer flexible circuit. The flexible circuit includes a first layer, a second layer and a third layer. The circuit engages a piezoelectric material/electrode subassembly. Vias are used to operatively connect ground electrodes of individual transducer elements to grounds in the third layer of the circuit. The vias extend through the first and second layers to the third layer of the circuit. When the flexible circuit is diced during the assembly of the transducer system, no cuts are made in the third layer of the circuit. As a result, a common ground connection is maintained by way of the grounds in the third layer of the circuit. Thus, no subsequent operation of reconnecting the common ground electrode is required.