Abstract: The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130°-140° C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.

Abstract: The present disclosure relates to UV resistant multi-component structural adhesive systems that are substantially free of aromatic epoxy resins, Also provided are methods of preparing the multi-component structural adhesive systems and methods of bonding substrates together with such adhesive systems.

Abstract: The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130°-140° C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.

Abstract: The present disclosure provides a hybrid benzoxazine resin and a method for producing such a resin by reacting an aldehyde compound and an organic primary monoamine with a multifunctional phenol monomer and a monofunctional phenol monomer in the presence or absence of a solvent. The hybrid benzoxazine resin may be easily recovered and provides a resin that is substantially monofunctional phenol-free and therefore useful in a variety of applications and products, such as in aerospace and transportation interior applications and products.

Abstract: The present disclosure relates to UV resistant multi-component structural adhesive systems that are substantially free of aromatic epoxy resins, Also provided are methods of preparing the multi-component structural adhesive systems and methods of bonding substrates together with such adhesive systems.

Abstract: A Mannich base curing agent is provided, prepared by reacting butyraldehyde, a phenolic compound and a primary or secondary amine. These curing agents are useful as sole curing agents or as co-curing agents for epoxy resin systems.