Abstract: A structural packaging assembly to support a multi-function optic chip or the like is mountable in a gyroscopic unit. An example assembly includes a housing mounted to a mounting plate. The chip is located in the housing, which in turn is coupled to a mounting plate. The housing may have a prescribed section modulus capable of sufficiently withstanding applied vibrations within a predefined vibrational range, such as a vibrational range at or below about 3500 Hz. The structural packaging assembly utilizes a mounting system with mounting feet that clamp to dowels, which in turn have been press fit into the mounting plate. In one embodiment, the mounting feet take the form of “C” clamp mechanisms, which after being clamped to the dowels, allow for resonance dampening between the housing and the mounting plate.