Patents by Inventor Derek Tyler

Derek Tyler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070131315
    Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1% of silver. A process to manufacture the alloys of the invention as well as other copper-nickel-silicon alloys includes the sequential steps of (a). casting the copper alloy; (b). hot working the cast copper-base alloy to effect a first reduction in cross-sectional area; (c).
    Type: Application
    Filed: October 26, 2006
    Publication date: June 14, 2007
    Inventors: Frank Mandigo, Peter Robinson, Derek Tyler, Andreas Boegel, Hans-Achim Kuhn, Frank Keppeler, Joerg Seeger
  • Publication number: 20060076090
    Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1% of silver. A process to manufacture the alloys of the invention as well as other copper-nickel-silicon alloys includes the sequential steps of (a). casting the copper alloy; (b). hot working the cast copper-base alloy to effect a first reduction in cross-sectional area; (c).
    Type: Application
    Filed: October 7, 2005
    Publication date: April 13, 2006
    Inventors: Frank Mandigo, Peter Robinson, Derek Tyler, Andreas Boegel, Hans-Achim Kuhn, Frank Keppeler, Joerg Seeger
  • Publication number: 20050025990
    Abstract: The present invention is directed to a coated substrate, comprising: an antitarnish layer deposited on a substrate in an amount effective to prevent tarnishing of said coated substrate; and an outer layer deposited onto said antitarnish layer, said outer layer comprising tin or tin alloys having at least 50% by weight tin. The present invention is also directed to coated substrates having a concentration gradient of antitarnish agent diffused into the coating, as well as methods of forming such coated substrates.
    Type: Application
    Filed: August 31, 2004
    Publication date: February 3, 2005
    Inventors: Christopher Laurello, Derek Tyler, Szuchain Chen, Julius Fister