Patents by Inventor Derek Wayne Puccio

Derek Wayne Puccio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9038263
    Abstract: Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: May 26, 2015
    Assignee: Delaware Capital Formation, Inc.
    Inventors: Derek Wayne Puccio, Errol P. EerNisse
  • Publication number: 20120181900
    Abstract: Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 19, 2012
    Applicant: DELAWARE CAPITAL FORMATION, INC.
    Inventors: Derek Wayne Puccio, Errol P. EerNisse