Abstract: Embodiments disclosed herein include a semiconductor manufacturing tool with a hybrid model and methods of using the hybrid model for processing wafers and/or developing process recipes. In an embodiment, a method for developing a semiconductor manufacturing process recipe comprises selecting one or more device outcomes, and querying a hybrid model to obtain a process recipe recommendation suitable for obtaining the device outcomes. In an embodiment, the hybrid process model comprises a statistical model and a physical model. In an embodiment, the method may further comprise executing a design of experiment (DoE) on a set of wafers to validate the process recipe recommended by the hybrid process model.

Abstract: A method includes receiving a set of feature models, each feature model of the set of feature models corresponding to a respective feature associated with processing of a component, receiving a set of target properties for processing the component, where the set of target properties includes, for each feature, a respective target, determining, based on the set of feature models, one or more sets of predicted processing parameters in view of the set of target properties, generating one or more candidate process recipes each corresponding to a respective one of the one or more sets of predicted processing parameters, where the one or more candidate process recipes each correspond to a set of predicted properties including, for each feature, a respective predicted property value resulting from component processing, and selecting, from the one or more candidate process recipes, a process recipe for processing the component.

Abstract: A method includes determining, by a processing device, whether a first process recipe including a set of Pareto efficient parameters is to be selected from a set of process recipes, wherein the set of Pareto efficient parameters fail to satisfy each target property of a set of target properties for processing the component, in response to determining that a first process recipe is not to be selected from a set of process recipes for processing the component, selecting, by the processing device from the set of process recipes, a second process recipe including a set of parameters satisfying each target property of the set of target properties, and causing, by the processing device, the component to be processed by a process tool using the second process recipe.

Abstract: Embodiments disclosed herein include a semiconductor manufacturing tool with a hybrid model and methods of using the hybrid model for processing wafers and/or developing process recipes. In an embodiment, a method for developing a semiconductor manufacturing process recipe comprises selecting one or more device outcomes, and querying a hybrid model to obtain a process recipe recommendation suitable for obtaining the device outcomes. In an embodiment, the hybrid process model comprises a statistical model and a physical model. In an embodiment, the method may further comprise executing a design of experiment (DoE) on a set of wafers to validate the process recipe recommended by the hybrid process model.

Abstract: A method includes receiving a set of feature models, each feature model of the set of feature models corresponding to a respective feature associated with processing of a component, receiving a set of target properties for processing the component, where the set of target properties includes, for each feature, a respective target, determining, based on the set of feature models, one or more sets of predicted processing parameters in view of the set of target properties, generating one or more candidate process recipes each corresponding to a respective one of the one or more sets of predicted processing parameters, where the one or more candidate process recipes each correspond to a set of predicted properties including, for each feature, a respective predicted property value resulting from component processing, and selecting, from the one or more candidate process recipes, a process recipe for processing the component.

Abstract: Embodiments disclosed herein include a semiconductor manufacturing tool with a hybrid model and methods of using the hybrid model for processing wafers and/or developing process recipes. In an embodiment, a method for developing a semiconductor manufacturing process recipe comprises selecting one or more device outcomes, and querying a hybrid model to obtain a process recipe recommendation suitable for obtaining the device outcomes. In an embodiment, the hybrid process model comprises a statistical model and a physical model. In an embodiment, the method may further comprise executing a design of experiment (DoE) on a set of wafers to validate the process recipe recommended by the hybrid process model.

Abstract: A system includes a memory and a processing device, operatively coupled to the memory, to perform operations including receiving, as input to a trained machine learning model for identifying defect impact with respect to at least one type defect type, data associated with a process related to electronic device manufacturing. The data associated with the process comprises at least one of: an input set of recipe settings for processing a component, a set of desired characteristics to be achieved by processing the component, or a set of constraints specifying an allowable range for each setting of the set of recipe settings. The operations further include obtaining an output by applying the data associated with the process to the trained machine learning model. The output is representative of the defect impact with respect to the at least one defect type.

Abstract: Embodiments disclosed herein include a semiconductor manufacturing tool with a hybrid model and methods of using the hybrid model for processing wafers and/or developing process recipes. In an embodiment, a method for developing a semiconductor manufacturing process recipe comprises selecting one or more device outcomes, and querying a hybrid model to obtain a process recipe recommendation suitable for obtaining the device outcomes. In an embodiment, the hybrid process model comprises a statistical model and a physical model. In an embodiment, the method may further comprise executing a design of experiment (DoE) on a set of wafers to validate the process recipe recommended by the hybrid process model.