Patents by Inventor Derrell Wertz

Derrell Wertz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7589972
    Abstract: An electrical connector assembly (100) made in accordance with a preferable embodiment of the present invention comprises an electrical socket (20) with a plurality of contacts received therein, an IC module (30) mounted onto the electrical socket (20) so as to make electrical connection therebetween, a heat sink assembly (40) pressing on the IC module (30) and including a heat spreader (401), and a clip (50) fastening the heat sink assembly (40) above the IC module (30). The IC module (30) comprises a substrate (301) and at least one die (302) attached on a top surface of the substrate (301). The clip (50) has a set of first fingers (504) for pressing the die (301) of the IC module (30) and a set of second fingers (505) for pressing the substrate (301) of the IC module (30).
    Type: Grant
    Filed: May 26, 2007
    Date of Patent: September 15, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hao-Yun Ma, Ming Lun Szu, Derrell Wertz
  • Publication number: 20080291638
    Abstract: Provided a clip set (50) for pressing a CPU toward LGA contacts of a CPU socket comprises, a rigid body having an elongate base (501) with upper and lower edges. A set of first pressing finger (502) extends from the upper edge traversally and away from the base. Each of the first pressing fingers includes a first pressing pad located at a first plane. A set of second pressing finger (503) extends from and away from the base, and includes a second pressing pad located at a second plane differential to the first plane. The set of first and second pressing fingers are dimensioned to be located in two different levels so as to assert downward pressure to a die (302) of the CPU and a substrate (301) of the CPU, respectively.
    Type: Application
    Filed: May 26, 2007
    Publication date: November 27, 2008
    Inventors: Hao-Yun Ma, Ming Lun Szu, Derrell Wertz