Abstract: A conductive adhesive composition includes a cross-linkable, adhesive component, a fluxing agent, and a conductive metal that has a surface on which is present a metal oxide. The adhesive component includes an epoxy resin and the fluxing agent includes a phenol. The phenol is reactive with the metal oxide on the surface of the conductive metal to at least partially remove the metal oxide from the surface of the conductive metal. As a result, a conductivity of the conductive adhesive composition is increased. The composition is particularly useful at interfaces between electrical or electronic components where it serves to physically mount and electrically connect necessary components and to continuously inhibit metal oxides from forming.

Abstract: A conductive composition includes a conductive metal, a first resin component, and a second resin component, which is an isocyanate component, that is reactive with the first resin component. A metal oxide and a lubricant are present as impurities on a surface of the metal. The second resin component is blocked at a first temperature and unblocked at a second temperature greater than the first temperature to produce fist and second fluxing agents. The first fluxing agent reacts with the lubricant to partially remove the oxide and the lubricant from the surface of the metal. The removal, or cleansing, of the oxide and the lubricant from the metal increases a conductivity of the composition. A method deposits a trace of the composition on a substrate and heats the composition to the second temperature to cause the second resin component to unblock.