Patents by Inventor Derui Yin

Derui Yin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuits with alignment marks and methods of producing the same
    Patent number: 9633882
    Abstract: Methods of producing integrated circuits with interposers and integrated circuits produced from such methods are provided. In an exemplary embodiment, a method of producing an integrated circuit includes forming a base layer overlying a substrate, and forming an alignment mark overlying the base layer. A first layer is formed overlying the base layer and the alignment mark, and the first layer has a first layer thickness. A second layer is formed overlying the first layer, where the second layer has a second layer thickness and where a combined thickness of the first and second layer thicknesses is from about 2 to about 50 micrometers. A second component is formed from the second layer.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: April 25, 2017
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Ying Yu, Jianbo Sun, Derui Yin, Yelehanka Ramachandramurthy Pradeep, Rakesh Kumar
  • INTEGRATED CIRCUITS WITH ALIGNMENT MARKS AND METHODS OF PRODUCING THE SAME
    Publication number: 20170092523
    Abstract: Methods of producing integrated circuits with interposers and integrated circuits produced from such methods are provided. In an exemplary embodiment, a method of producing an integrated circuit includes forming a base layer overlying a substrate, and forming an alignment mark overlying the base layer. A first layer is formed overlying the base layer and the alignment mark, and the first layer has a first layer thickness. A second layer is formed overlying the first layer, where the second layer has a second layer thickness and where a combined thickness of the first and second layer thicknesses is from about 2 to about 50 micrometers. A second component is formed from the second layer.
    Type: Application
    Filed: September 29, 2015
    Publication date: March 30, 2017
    Inventors: Ying Yu, Jianbo Sun, Derui Yin, Yelehanka Ramachandramurthy Pradeep, Rakesh Kumar