Abstract: A refrigeration unit includes a compressor, an evaporator, a fan, and an air duct component, utilizing the evaporator for cooling and the fan to deliver cold air formed by heat exchange with the evaporator into compartments for cooling; a heating unit for transferring heat generated by the heating unit into the compartments for heating; a temperature sensor unit for detecting the actual temperature inside the compartments and the external environment temperature; and a control mainboard that selects cooling or heating based on the actual temperature within the compartments.

Abstract: A semiconductor molding system is provided that includes a molding device, an image collection device, and a controller connected to the molding device and the image collection device. The image collection device is configured to obtain a target image of a to-be-molded lead frame before the to-be-molded lead frame is molded by the molding device. The controller is configured to determine whether foreign object(s) exist in a non-molding area of the to-be-molded lead frame based on the target image of the to-be-molded lead frame and a reference image. A method for detecting foreign objects of a to-be-molded lead frame is also provided.

Abstract: A constant temperature control method, an electronic device, and a constant temperature wine cabinet.