Patents by Inventor Desmond Chong Yok Rue

Desmond Chong Yok Rue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3D MEMS/MOEMS package
    Publication number: 20040140475
    Abstract: Two substrates each carrying MEMS or MOEMS structures are bonded face to face and interconnected to form a compact surface-mountable package.
    Type: Application
    Filed: January 21, 2003
    Publication date: July 22, 2004
    Applicant: United Test & Assembly Center Limited
    Inventors: Yi-Sheng Sun, Desmond Chong Yok Rue, Rahul Kapoor
  • Wl-bga for MEMS/MOEMS devices
    Publication number: 20040140557
    Abstract: A MEMS/MOEMS device is provided on a first substrate which is bonded to a second substrate to form a package. Interconnections may be provided via the second substrate and an hermetic seal may be formed to protect the MEMS/MOEMS device from outgassing.
    Type: Application
    Filed: January 21, 2003
    Publication date: July 22, 2004
    Applicant: United Test & Assembly Center Limited
    Inventors: Yi-Sheng Sun, Desmond Chong Yok Rue, Rahul Kapoor