Patents by Inventor Desthree DARWIN

Desthree DARWIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrolytic copper plating bath compositions and a method for their use
    Patent number: 10538850
    Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: January 21, 2020
    Assignee: Atotech Deutschland GmbH
    Inventors: Heiko Brunner, Dirk Rohde, Manuel Pölleth, Sven Rückbrod, Desthree Darwin, Sandra Niemann, Gerhard Steinberger
  • ELECTROLYTIC COPPER PLATING BATH COMPOSITIONS AND A METHOD FOR THEIR USE
    Publication number: 20180112320
    Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.
    Type: Application
    Filed: April 20, 2016
    Publication date: April 26, 2018
    Applicant: Atotech Deutschland GmbH
    Inventors: Heiko BRUNNER, Dirk ROHDE, Manuel PÖLLETH, Sven RÜCKBROD, Desthree DARWIN, Sandra NIEMANN, Gerhard STEINBERGER