Abstract: A heat flow which is introduced into a chip module from the outside is specifically controlled to avoid delaminations between a covering composition and a chip during a hot-melt incorporation process. This takes place either by a heat-insulating layer which is interposed between a flexible carrier tape of the chip module and a chip adhesively fixed thereon, or by clearances within an area or layer of metal contacts. As a result, a heat flow from a hollow punch brought down in an outer region of the metal contacts, in the direction of the centrally mounted chip, is prevented.