Abstract: A metrology device is described which is couplable to a load port of a semiconductor product handling and/or processing tool. The tool encloses a mini-environmental atmosphere and has a load port table for supporting devices to be coupled to the load port. The metrology device contains a housing preserving an inner atmosphere, a coupling region for connecting the inner atmosphere to the mini-environmental atmosphere and a measuring device for measuring a property of a semiconductor product. The metrology device further has a support which is movable by a transport device and which is dimensioned such that the metrology device is self-supporting in a position appropriate for coupling the coupling region to the load port. The metrology device is thereby couplable to the load port without being supported by the load port table.

Abstract: The invention relates to an inspection system for optically examining the surfaces of objects to detect surface errors. The system scans image strips and, consequently, a given surface rapidly and with sufficient resolution using a linescan camera and an upstream microscope by aligning the captured lines.

Abstract: A metrology device is described which is couplable to a load port of a semiconductor product handling and/or processing tool. The tool encloses a mini-environmental atmosphere and has a load port table for supporting devices to be coupled to the load port. The metrology device contains a housing preserving an inner atmosphere, a coupling region for connecting the inner atmosphere to the mini-environmental atmosphere and a measuring device for measuring a property of a semiconductor product. The metrology device further has a support which is movable by a transport device and which is dimensioned such that the metrology device is self-supporting in a position appropriate for coupling the coupling region to the load port. The metrology device is thereby couplable to the load port without being supported by the load port table.

Abstract: A wafer marking is disclosed, which is represented by a large number of soft marks incorporated into a surface of a wafer. The soft marks each have a depth of at least 4 &mgr;m, an internal diameter of at least 50 &mgr;m and, in a particularly advantageous manner, a minimum gradient their surface of 0.2. These depressions can be proded, using appropriate technology, with depths of up to &mgr;m.

Abstract: A configuration for the automatic inscription or reinscription of wafers provides the wafers with a marking for identification and for process management during the production of semiconductor components. The wafer must be moved between different stations for the automatic inscription of a wafer in an appropriate device. Considerable transport movements are saved by the integration of a read station in an inscription chamber having a positioning unit for the wafer.

Abstract: The method is for use in a bar code reader. By means of a special illumination of the bar code applied to a reflecting surface/wafer and special receiver optics, bright-field illumination is implemented. Optimum contrasts between the images of the marking elements and the surrounding reflecting areas offer a high recognition reliability.

Abstract: An optical pick-up device for image processing systems has an objective for generating an optical image of a subject to be registered, an image-to-signal transducer, particularly a CCD camera that converts the optical image into a video signal and an illumination device for illumination of the subject to be registered in incident light. The rugged and high-performance illumination device, that yields an optimum light distribution in the plane of registration, has a plurality of infrared diodes that are arranged with equal spacing on at least one circle coaxial with the optical axis of the objective. It also has at least one annular deflection device that is similarly arranged coaxial with the optical axis. This deflection device concentrates the light emitted by the infrared diodes obliquely onto the subject from all sides.