Patents by Inventor Detlef Heindl

Detlef Heindl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Filler based on silicon dioxide, method for its preparation, and its use
    Patent number: 5852096
    Abstract: Porous silicon dioxide glass is proposed as an inorganic filler for polymerizable materials, which has a particle size of 0.5-50 micrometers, a pore size of 20-120 nanometers, a pore volume of 200-1000 mm.sup.3 /g and a BET surface area of 10-100 m.sup.2 /g. The polymer products containing the filler are characterized by a very good resistance to abrasion.
    Type: Grant
    Filed: March 26, 1997
    Date of Patent: December 22, 1998
    Assignee: Heraeus Kulzer GmbH
    Inventors: Detlef Heindl, Albert Erdrich
  • Polymerizable material
    Patent number: 5750590
    Abstract: Polymerizable materials that contain "oxetanes" (trimethylene oxides) shrink only slightly when polymerized in the presence of a cationic polymerization catalyst. The materials are particular appropriate for coatings and for medical and dental purposes.
    Type: Grant
    Filed: July 3, 1996
    Date of Patent: May 12, 1998
    Assignee: Heraeus Kulzer GmbH
    Inventors: Roland Schaefer, Detlef Heindl, Dieter Schodel, Oskar Nuyken, Ralf Bohner, Christoph Erdmann
  • Polymerizable dental material
    Patent number: 5228907
    Abstract: Radiopaque, abrasion-resistant tooth fillings and inlays that can be polished to a high gloss can be made from a dental material that, in addition to monomeric dimethacrylates, contains a filler mixture of 80 to 90 weight % barium aluminum silicate glass, having a mean particle size of 0.5 to 1.5 .mu.m, and 10 to 20 % weight silicon dioxide, having a mean particle size of 0.04 to 0.06 .mu.m. The dental material is also suitable for anchoring dental prostheses.
    Type: Grant
    Filed: November 7, 1991
    Date of Patent: July 20, 1993
    Assignee: Heraeus Kulzer GmbH
    Inventors: Regina Eppinger, Bernhard Eppinger, Detlef Heindl, Peter J. Kohler, Joachim Fritze