Abstract: The invention relates to smart cards. In one embodiment a smart card has a card body having at least a first, a second and a third layer. The first and the second layer are at least partly composed of polycarbonate. The third layer is arranged between the first and the second layer and is composed of a material having a melting point of Ts<150° C.

Abstract: A product label includes a semiconductor chip and an antenna. The semiconductor chip stores information about a product. The antenna transmits the information about the product to a reading device. The antenna has a predetermined breaking point at which the antenna can be destroyed during the reading operation by energy introduced by the reading device so that the product label can be read only for a specific number of read cycles. A method of producing product labels and a method for a contactless, forgery-proof identification of products are also provided.

Abstract: A smart-card module is described which has a substrate film of an anisotropically conductive material and at least one semiconductor chip. The semiconductor chip has connection points. On one surface of the semiconductor film, contact areas are applied directly. The substrate film is disposed between the semiconductor chip and the contact areas in such a way that it connects the connection points of the semiconductor chip to the contact areas in a manner of a direct contact.

Abstract: In a smart card module for biometric sensors for installation in smart cards, a support has at least one through opening or window in the region of a sensor chip. The sensor chip is mounted on the support such that an active surface of the sensor chip is directed toward the support and is situated in the region of the window, so that it can be accessed through the window in the support.

Abstract: A machine-readable label has an IC chip configured on a backing film in a clearance in the adhesive layer applied to the backing film. At least one terminal contact of this IC chip is connected in an electrically conducting manner to an electrical conductor that has been applied to the backing film and that is intended as an antenna for transmitting data and energy in a contactless manner.

Abstract: A display unit includes activation or driver electronics disposed on the rear side of a display element. A display unit has a front region with a display element; a rear region, facing away from the front region, with at least one control element for the activation of the at least one display element; and electrical lines for the connection of the at least one display element to the at least one control element. Preferably, an LCD display with a top layer, a liquid crystal layer, and a bottom sheet is used. The control element is disposed on the bottom sheet. The control element is, for example, an unpackaged IC, that is attached to the bottom sheet folded back on itself and is laterally offset in such a way that it cannot overheat the actual LCD display. The electrical lines are preferably conductor tracks on the bottom sheet.

Abstract: A fingertip sensor with a biometric sensor element for detecting fingerprints, the activation or deactivation is effected by touching and releasing the sensor element.

Abstract: A smart-card module is described which has a substrate film of an anisotropically conductive material and at least one semiconductor chip. The semiconductor chip has connection points. On one surface of the semiconductor film, contact areas are applied directly. The substrate film is disposed between the semiconductor chip and the contact areas in such a way that it connects the connection points of the semiconductor chip to the contact areas in a manner of a direct contact.

Abstract: A product label includes a semiconductor chip and an antenna. The semiconductor chip stores information about a product. The antenna transmits the information about the product to a reading device. The antenna has a predetermined breaking point at which the antenna can be destroyed during the reading operation by energy introduced by the reading device so that the product label can be read only for a specific number of read cycles. A method of producing product labels and a method for a contactless, forgery-proof identification of products are also provided.

Abstract: A display unit includes activation or driver electronics disposed on the rear side of a display element. A display unit has a front region with a display element; a rear region, facing away from the front region, with at least one control element for the activation of the at least one display element; and electrical lines for the connection of the at least one display element to the at least one control element. Preferably, an LCD display with a top layer, a liquid crystal layer, and a bottom sheet is used. The control element is disposed on the bottom sheet. The control element is, for example, an unpackaged IC, that is attached to the bottom sheet folded back on itself and is laterally offset in such a way that it cannot overheat the actual LCD display. The electrical lines are preferably conductor tracks on the bottom sheet.

Abstract: A chip card module contains, in addition to conductor tracks and a chip carrier, one or more semiconductor chips and, if necessary, a stiffening frame. The semiconductor chip(s) and/or stiffening frame are attached with the aid of an adhesive, with which particles of a defined size are admixed as spacers. The adhesive in preferably a flexible adhesive, and the particles preferably are formed of a deformable material. The invention has the effect that the semiconductor chip(s) and/or stiffening frame are adhesively attached to the underlying surface at a defined, uniform distance. The flexible adhesive and the deformable particles adapt to deformations of the chip card module and thus prevent damage to the adhesively bonded mating surfaces.

Abstract: A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.

Abstract: The sensor device is provided for sensing biometric characteristics, in particular finger minutiae, with a biometric sensor chip. The sensor chip is fastened on a flexible printed circuit board that has a highly flexible substrate layer and conductor tracks applied to the substrate layer. The conductor tracks are in electrical contact with the sensor chip and are led to a terminal region of the flexible printed circuit board. The sensing area of the sensor chip is accessible through an opening in the flexible circuit board and the opening is at least partially surrounded by a grounding frame.

Abstract: A carrier element for a semiconductor chip which can be incorporated in smart cards and soldered onto circuit boards using SMD technology. For this purpose, a copper lamination of a plastic sheet is structured by etching in such a way that contact areas are formed in one piece with conductor tracks which end at the edge of the carrier element and enable reliable soldering.

Abstract: A data card includes a card body having at least one card top layer and at least one card bottom layer. The outer dimensions of the top and bottom card layers correspond to one another, and a module element is fitted in between the card top layer and card bottom layer. The module element has an integrated electronic circuit for processing and/or storing personal data. A levelling compensating layer has a levelling material and is disposed or formed between the module element and the card top layer and/or the card bottom layer for filling existing cavities in the module element or between the module element and the card top layer and/or card bottom layer. The levelling compensating layer also fills or levels existing protruding elevations on a surface of the module element.

Abstract: The chip module is particularly suitable for implanting in a smart card body. The module has a carrier and a chip fitted on the carrier. A pedestal or base-type elevation formed on the carrier laterally surrounds the chip completely or partly.

Abstract: A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.

Abstract: A wafer frame for fixing and handling 200 mm wafers is produced with a significantly reduced weight as compared to a metal wafer frame, while maintaining mechanical and thermal material properties. This is accomplished by producing the wafer frame from a plastic with a glass fiber content of from 1 to 40% by weight.

Abstract: A data medium in card form has a least one semiconductor memory element with a storage capacity of at least one megabit and has electroplated contacts for transmission of data between a data processing system the semiconductor memory elements of the data medium. Electrical conductor paths on the data medium connect the semiconductor memory element to the electroplated contacts. The electrical conductor paths are a single leadframe on which at least parts of the electroplated contacts are integrally formed. The leadframe is formed of a resilient material.

Abstract: A smart card module includes a semiconductor chip that is electrically conductively connected to a metallic lead frame in which contact areas are formed. The semiconductor chip and the contact areas are electrically conductively contacted through connection areas disposed on a surface of an electrically insulating protective layer applied to the semiconductor chip. That surface faces away from the semiconductor chip. Contact can be established between the connection areas and the contact areas through the use of soldered joints or electrically conductive adhesive bonds. A smart card including the smart card module is also provided.