Patents by Inventor Detlef Tenbrink

Detlef Tenbrink has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a high temperature resistant copper coating on an inorganic dielectric
    Patent number: 5183553
    Abstract: The method of forming a high temperature resistant copper coating on a ceramic and/or enamel substrate, includes the steps of chemically depositing a copper layer having a thickness of at least 3 .mu.m on the substrate, heating the copper layer formed thereon at a temperature of from 200.degree. to 450.degree. C., mechanically treating the copper layer with brush and polishing means to consolidate an upper surface thereof and galvanically depositing an additional copper layer having a thickness of 3 .mu.m on the upper surface. The high temperature resistant copper coating for the ceramic or enamel substrate can stand a higher thermal load for a longer time than similar conventional coatings and can act to rapidly dissipate heat generated by electronic components.
    Type: Grant
    Filed: July 13, 1989
    Date of Patent: February 2, 1993
    Assignee: Schering Aktiengesellschaft
    Inventors: Detlef Tenbrink, Martin Bock, Kurt Heymann, Martin Rimkus
  • Method of production galvanically deposited aluminum layers for use as contacts of microcircuits
    Patent number: 4869926
    Abstract: Contacts of microcircuits are produced by galvanically depositing aluminum layers on a substrate carrying a microcircuit.
    Type: Grant
    Filed: March 17, 1987
    Date of Patent: September 26, 1989
    Assignee: Schering Aktiengesellschaft
    Inventors: Martin Bock, Detlef Tenbrink