Abstract: Disclosed is a semiconductor package including a wiring substrate, an external connection terminal on a bottom surface of the wiring substrate, an interposer substrate on a top surface of the wiring substrate, a first semiconductor chip on the interposer substrate, and a first chip stack on the interposer substrate and horizontally spaced apart from the first semiconductor chip. The wiring substrate includes a core, an upper redistribution layer covering a top surface of the core, and a lower redistribution layer covering a bottom surface of the core. The core includes core through vias vertically penetrating the core, and a first thermal radiation structure below the first chip stack and in the core. The first thermal radiation structure is electrically insulated from the upper and lower redistribution layers. A thermal conductivity of the first thermal radiation structure is greater than that of the core.

Abstract: The embodiments relate to a heat-shrinkable film and a process for preparing the same. The heat-shrinkable film comprises a mixed resin, wherein the mixed resin comprises a copolymerized polyester-based resin in which a diol and a dicarboxylic acid are copolymerized; and a polybutylene terephthalate-based resin, and, when a specimen of the heat-shrinkable film having a width of 15 mm, a length of 110 mm, and a thickness of 45 ?m is immersed in hot water at 70° C. for 60 seconds to measure shrinkage stress, the development time of the initial shrinkage stress is 20 seconds or shorter. The heat-shrinkable film according to the embodiment comprises a mixed resin having a specific composition, wherein the development time of the initial shrinkage stress is controlled.

Abstract: A semiconductor chip including a body that having a front surface and a rear surface; a wiring structure above the front surface of the body; a through via penetrating the body, and the through via is connected to the wiring structure; a heat dissipation structure above the rear surface of the body, and the heat dissipation structure includes a conductive layer connected to the through via; and a signal pad and a heat dissipation pad on the heat dissipation structure, and the signal pad and the heat dissipation pad are connected to the conductive layer.

Abstract: A semiconductor package according to an embodiment includes a connection substrate, a first semiconductor chip, and a second semiconductor chip. The first semiconductor chip is disposed on the connection substrate and includes a first interconnection area facing the connection substrate. The second semiconductor chip is disposed on the connection substrate and includes a second interconnection area facing the connection substrate. The second semiconductor chip includes a first edge adjacent to the first semiconductor chip and a second edge opposite to the first edge in a first direction. A first distance between the second interconnection area and the first edge in the first direction is different from a second distance between the second interconnection area and the second edge in the first direction.

Abstract: A semiconductor package includes: a first base chip including a plurality of first vias; a chip stack disposed on the first base chip; and a second base chip disposed between the first base chip and the chip stack, wherein the second base chip includes a plurality of second vias, wherein the chip stack includes memory chips that are stacked on the second base chip, wherein each of the memory chips includes a plurality of third vias, and wherein the first base chip and the second base chip are logic chips.

Abstract: A semiconductor package may include vertically-stacked semiconductor chips and first, second, and third connection terminals connecting the semiconductor chips to each other. Each of the semiconductor chips may include a semiconductor substrate, an interconnection layer on the semiconductor substrate, penetration electrodes connected to the interconnection layer through the semiconductor substrate, and first, second, and third groups on the interconnection layer. The interconnection layer may include an insulating layer and first and second metal layers in the insulating layer. The first and second groups may be in contact with the second metal layer, and the third group may be spaced apart from the second metal layer. Each of the first and third groups may include pads connected to a corresponding one of the first and third connection terminals in a many-to-one manner. The second group may include pads connected to the second connection terminal in a one-to-one manner.

Abstract: A semiconductor package includes a first semiconductor chip. A second semiconductor chip is disposed on the first semiconductor chip. A bump structure is disposed between the first semiconductor chip and the second semiconductor chip. The bump structure electrically connects the first semiconductor chip and the second semiconductor chip to each other. The bump structure includes a first bump pad and a second bump pad disposed on a same plane as each other, and a solder bump disposed between the first bump pad and the second bump pad. The solder bump abuts on a side of the first bump pad and a side of the second bump pad.

Abstract: Provided are a novel polypeptide having endolysin activity, a fusion protein comprising the polypeptide and an antibiotic active protein, and an antibiotic use against a gram-negative pathogen of the polypeptide and/or fusion protein and/or a use for prevention and/or treatment of gram-negative pathogen infection and/or disease or symptoms related to gram negative pathogen infection.

Abstract: A method of forming a thin film using a substrate processing apparatus includes placing the substrate on the electrostatic chuck, depositing the thin film on the substrate, transferring the substrate, and performing a hardening process. The depositing the thin film on the substrate applies a first DC power source to chuck the substrate, supplies a process gas and applies a first RF power source to form a first plasma to deposit the thin film on the substrate. The transferring the substrate transfers the substrate on which the thin film has been deposited outside the process chamber. The performing a hardening process applies a second DC power source, supplies a purge gas, and applies a second RF power source to form the plasma to harden a deposition film formed in an interior of the process chamber.

Abstract: A polyester film according to one embodiment has improved thermal properties and chemical properties by controlling the crystallinity of a copolymerized polyester and, particularly, exhibits excellent shrinkage per unit temperature as well as adhesiveness by means of a solvent, and thus is suitable for a heat-shrinking process and a seaming process. Therefore, the polyester film according to said embodiment can be usefully applied, as a heat-shrinkable label or packaging material, to containers of various products comprising drinks or food.

Abstract: This application relates to an adsorption desalination system using a multi-effect evaporator apparatus. In one aspect, the system includes a multi-effect evaporator apparatus producing high-pressure vapor and low-pressure vapor, a plurality of reaction units including an adsorbent adsorbing or desorbing moisture from the high-pressure vapor and low-pressure vapor and a heat exchange tube transferring heat to the adsorbent. The system may also include a condenser condensing vapor containing moisture desorbed from the adsorbents, and cold-hot water lines selectively supplying chilled water and hot water to the heat exchange tubes. The system may further include vapor lines connecting the multi-effect evaporator apparatus and the reaction units, and the reaction units and the condenser, respectively, valves disposed in the vapor lines, and a valve controller controlling operation of the valves to selectively supply chilled water or hot water supplied to the heat exchange tubes from the cold-hot water lines.

Abstract: Embodiments relate to a polyester film, preparation method thereof and method for reproducing polyethyleneterephthalate (PET) container using same, the crystallization temperature (Tc) of the polyester film is not measured or is 70° C. to 130° C., as measured by differential scanning calorimetry, whereby it is possible to easily control the crystallinity. Accordingly, the polyester film has excellent shrinkage characteristics and recyclability, and clumping rarely occurs even if it is dried at high temperatures for a long period of time in the regeneration process.

Abstract: Disclosed herein a video editing method, device and computer program capable of performing backup. The method includes: loading original media selected as an editing target by a user into a clip setting area of a video project; creating trim media according to a trim request of the user for the original media loaded into the clip setting area; and storing the trim media as backup media, in response to a request to set storage of the backup media in the video project by the user.

Abstract: Disclosed herein a content editing control method, device and computer program for fine adjustment control. The method includes: detecting initiation of a change of an object; presenting an adjustment menu related to the change of the object; receiving an adjustment item selected by input of a user in the adjustment menu; and controlling the change of the object according to an instruction of the user based on settings of the adjustment item specified by the user.

Abstract: Disclosed herein a content sharing method using dummy media, electronic device and computer program. The electronic device includes: an editing UI display unit configured to provide an editing UI including a dummy media creation UI to a display device; a user input checking unit configured to check user input information received through the dummy media creation UI; and an editing UI processing unit configured to create at least one dummy media according to input of the dummy media creation UI based on the user input information checked by the user input checking unit and to perform processing to share a video project including the dummy media according to a request.

Abstract: Disclosed herein a video editing user interface (UI) control device. The video editing UI control device includes: an editing UI display unit configured to visualize and display an editing UI including an editing history provision UI on a display device; a user input checking unit configured to check user input information based on user input touch-input through the display device; and an editing UI processing unit configured to generate and manage editing history information based on the user input information provided by the user input checking unit and to provide the editing history information in response to input of the editing history provision UI.

Abstract: The present disclosure relates to an electrode stack for a lithium secondary battery, in which one or more positive electrodes and one or more negative electrodes are alternatingly stacked with a separator therebetween and insulation layers are formed on the outermost positive electrodes of the electrode stack. The insulation layers have an average thickness of 1 ?m to 8 ?m. The positive electrodes include a positive electrode collector; a positive electrode active material layer; and a protective layer including an inorganic compound. The protective layer is disposed between the positive electrode collector and the positive electrode active material layer. Additionally, an electrode assembly and a lithium secondary battery which include the electrode stack are also disclosed.

Abstract: A polyester film according to one embodiment uniformly shrinks during a heat-shrinking process as the shrinkage rate is adjusted for each temperature range, and thus after shrinkage the polyester film can be attached to a container without any defects in external appearance such as distortion or curling. Therefore, the polyester film according to said embodiment can be usefully applied, as a heat-shrinkable label or packaging material, to containers of various products comprising drinks or food.

Abstract: A polyester film according to an embodiment is characterized in that the shrinkage properties in a direction perpendicular to a main shrinkage direction are adjusted under certain heat treatment conditions, and thus further deformation of the polyester film can be suppressed even when the polyester film goes through a harsh retort process after being tightly adhered to a container by means of heat shrinkage. Thus, the polyester film according to the embodiment can be effectively applied, as a heat-shrinkable label or packing material, to containers of various products including retort food.

Abstract: Proposed are a method of manufacturing a polarizing film and the polarizing film thereto that is not harmful to the human body by making the surface of a PC film hydrophilic, and laminating it with a PVA film using water-based adhesive on the surface of the hydrophilic PC film, in manufacturing the polarizing film by laminating a polycarbonate (PC: polyvinyl alcohol) film and a polyvinyl alcohol (PVA: polyvinyl alcohol) film constituting the polarizing film.