Patents by Inventor Dev Balaraman

Dev Balaraman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIE-COAT MATERIAL CONFIGURED TO ENHANCE DEVICE RELIABILITY AND DEVICES AND PROCESSES IMPLEMENTING THE SAME
    Publication number: 20240321659
    Abstract: A device includes device parts, a diamond-like based material coating arranged on one or more of the device parts. Additionally, the diamond-like based material coating may include at least one of a diamond-like carbon (DLC) material and/or a diamond-like nanocomposite (DLN) material.
    Type: Application
    Filed: March 22, 2023
    Publication date: September 26, 2024
    Inventors: Afshin DADVAND, Dev BALARAMAN
  • HIGH-PERFORMANCE STRESS BUFFER DIE-COAT AND DEVICES AND PROCESSES IMPLEMENTING THE SAME
    Publication number: 20240321663
    Abstract: A device may include device parts, a composite coating material arranged on one or more of the device parts, and a molding compound arranged on and/or around one or more of the device parts. Moreover, the device may include where the composite coating material may include a polymer matrix including and/or incorporating ceramic particles.
    Type: Application
    Filed: March 22, 2023
    Publication date: September 26, 2024
    Inventors: Afshin DADVAND, Dev BALARAMAN
  • POWER SEMICONDUCTOR DEVICES HAVING MOISTURE BARRIERS
    Publication number: 20230378010
    Abstract: A power semiconductor device comprises a package, a power semiconductor die within the package, and a moisture barrier on an upper surface and side surfaces of an exterior of the package.
    Type: Application
    Filed: May 18, 2022
    Publication date: November 23, 2023
    Inventors: Dev Balaraman, Geza Dezsi, Daniel Richter