Patents by Inventor Dev Barpanda

Dev Barpanda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BLENDS OF OKARA WITH CELLULOSE DERIVATIVES
    Publication number: 20200260770
    Abstract: Provided is a composition comprising (a) 0.5% to 15% okara or whole soy or a mixture thereof, by weight based on the weight of the composition, and (b) 0.1% to 1.4% one or more cellulose derivative selected from one or more methylcelluloses, one or more hydroxypropylmethylcelluloses, and mixtures thereof.
    Type: Application
    Filed: December 13, 2016
    Publication date: August 20, 2020
    Inventors: Yongfu Li, Tirtha Chatterjee, Puspendu Deo, Mark W. Beach, Matthew Larive, Dev Barpanda
  • Forming tool with integral cutting for composite material
    Patent number: 10315368
    Abstract: A forming and trimming tool (100) operable to form and trim a composite material part. The tool includes a lower die (150), a core (115) mounted to the lower die, at least one lower pressure pad (120) mounted to the lower die, and a cutter (125) mounted to the lower die. Additionally, the tool includes an upper die (105), a cavity mounted to the upper die, and at least one upper pressure pad (110) mounted to the upper die.
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: June 11, 2019
    Assignee: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Jeffrey D. Wenzel, Jay M. Tudor, Dev Barpanda, Scott R. Kaleyta
  • FORMING TOOL WITH INTEGRAL CUTTING FOR COMPOSITE MATERIAL
    Publication number: 20160046086
    Abstract: A forming and trimming tool (100) operable to form and trim a composite material part. The tool includes a lower die (150), a core (115) mounted to the lower die, at least one lower pressure pad (120) mounted to the lower die, and a cutter (125) mounted to the lower die. Additionally, the tool includes an upper die (105), a cavity mounted to the upper die, and at least one upper pressure pad (110) mounted to the upper die.
    Type: Application
    Filed: April 22, 2014
    Publication date: February 18, 2016
    Inventors: Jeffrey D. Wenzel, Jay M. Tudor, Dev Barpanda, Scott R. Kaleyta