Abstract: A flexible circuit comprises a flexible substrate having first and second opposing surfaces. The flexible substrate can include multiple layers. A plurality of electrical traces can be mounted on either or both surfaces of the flexible substrate. A plurality of electrical components can also be mounted on either or both surfaces of the flexible substrate. A plurality of tooling cutouts is recessed in the sides of the flexible circuit. The tooling cutouts can have various shapes, such as, but not limited to, semi-circular, multiple straight edges, a single or multiple curved edges, etc. The cutouts are used to position and hold the flexible circuit in at least one other device.

Abstract: Flexible printed circuit boards interconnect to adjacent electronic devices through one or more of high speed data, low speed data, high current, and ground lines and pads. The design of the high speed data pads and traces and adjacent ground pads and traces maintains a desired impedance in the flexible circuit and at the transition from the flexible circuit to a printed circuit board, a ceramic header, or other device to ensure high speed operation. The pads are preferably arranged in a two dimensional geometry such that a connecting area of the flexible circuit is narrower than it would preferably be if the pads were arranged linearly. The two dimensional array also allows the use of the high current thermoelectric cooler pads, which require large surface areas that may otherwise not fit in a conventional linear array.

Abstract: This disclosure concerns a platform suitable for use in connection with optoelectronic components and devices. In one example, the platform includes multiple stacked platform layers. A conductive pathway of the platform is supported by at least one of the stacked platform layers, and the conductive pathway is configured and arranged so as to be at least partly coextensive with the platform.

Abstract: Systems and methods for biasing an externally modulated laser. An inductorless bias T network is provided that includes a terminating resistor in series with a capacitor. The capacitor is an open circuit for a bias signal and a virtual ground for an RF signal. Thus, the RF signal is terminated by the terminating resistor without dissipating the bias signal through a ground return path of the RF signal. Using a charge pump inverter, a positive supply can be used to positively bias a laser and negatively bias the external modulator through the terminating resistor. A negative power supply is not required. A swing voltage provided by the RF signal causes the external modulator to modulate the light emitted by the laser.

Abstract: A small form factor transceiver module that incorporates an externally modulated laser (EML). The transceiver module has a transmitter optical subassembly with a header assembly having a base with a platform extending through. The platform has a plurality of conductive traces extending through the platform for making connections on both sides of the base. A thermoelectric cooler (TEC) is used to dissipate heat from a laser within the header assembly. The TEC dissipates heat sufficiently to allow the EML to be used in the header assembly. In this manner, EMLs can be used in relatively small optical devices, including small form factor transceivers that comply with the XFP standard. The XFP modules with EMLs can be used for longer links than XFPs without EMLs. In addition, EMLs can be stabilized using TECs so that XFP modules can be used for DWDM-type applications.

Abstract: This disclosure is concerned with transceiver modules. In one example, a transceiver module includes a receiver optical subassembly, as well as a transmitter optical subassembly having a header assembly and an externally modulated laser (EML). The header assembly includes a base with first and second sides, as well as a platform attached to the base and having an inside portion near the first side of the base and an outside portion near the second side of the base. The platform of the header assembly further includes a conductive pathway extending through part of the platform. The EML is supported by the platform and electrically communicates with the conductive pathway of the platform. The EML can be passively or actively cooled.

Abstract: A small form factor transceiver module that incorporates an externally modulated laser (EML). The transceiver module has a transmitter optical subassembly with a header assembly having a base with a platform extending through. The platform has a plurality of conductive traces extending through the platform for making connections on both sides of the base. A thermoelectric cooler (TEC) is used to dissipate heat from a laser within the header assembly. The TEC dissipates heat sufficiently to allow the EML to be used in the header assembly. In this manner, EMLs can be used in relatively small optical devices, including small form factor transceivers that comply with the XFP standard. The XFP modules with EMLs can be used for longer links than XFPs without EMLs. In addition, EMLs can be stabilized using TECs so that XFP modules can be used for DWDM-type applications.

Abstract: A multi-layer feedthrough structure for use in optoelectronic equipment. The feedthrough structure is composed of multiple stacked ceramic layers that together form a multi-layer platform. The multi-layer platform bisects the base portion of a header assembly that is located within the transmitter optical subassembly such that an interior portion of the multi-layer platform is located within the header assembly and an exterior portion is disposed outside. Each layer contains at least a portion of a plurality of conductive pathways that extend from the exterior to the interior portion of the multi-layer platform. A top insulating layer enables the conductive pathways to pass from the exterior to the interior portion of the platform without electrically contacting the header assembly base. The conductive pathways serve as electrical interconnects between components located within the header assembly and structures outside thereof.

Abstract: A transistor header assembly for use in transmitter optical subassemblies of optical transceivers. The header assembly has a base with a platform extending through. The platform has a conductive trace extending through the platform for making connections on both sides of the base. A thermoelectric cooler (TEC) is used to dissipate heat from a laser within the header assembly. The TEC dissipates heat sufficiently to allow an externally modulated laser (EML) to be used in the header assembly. In this manner, EMLs can be used in relatively small optical devices, including small form factor transceivers that comply with the XFP standard. The XFP modules with EMLs can be used for longer links than XFPs without EMLs. In addition, EMLs can be stabilized using TECs so that XFP modules can be used for DWDM-type applications.

Abstract: A multi-layer feedthrough structure for use in optoelectronic equipment. The feedthrough structure is composed of multiple stacked ceramic layers that together form a multi-layer platform. The multi-layer platform bisects the base portion of a header assembly that is located within the transmitter optical subassembly such that an interior portion of the multi-layer platform is located within the header assembly and an exterior portion is disposed outside. Each layer contains at least a portion of a plurality of conductive pathways that extend from the exterior to the interior portion of the multi-layer platform. A top insulating layer enables the conductive pathways to pass from the exterior to the interior portion of the platform without electrically contacting the header assembly base. The conductive pathways serve as electrical interconnects between components located within the header assembly and structures outside thereof.

Abstract: A small form factor transceiver module that incorporates an externally modulated laser (EML). The transceiver module has a transmitter optical subassembly with a header assembly having a base with a platform extending through. The platform has a plurality of conductive traces extending through the platform for making connections on both sides of the base. A thermoelectric cooler (TEC) is used to dissipate heat from a laser within the header assembly. The TEC dissipates heat sufficiently to allow the EML to be used in the header assembly. In this manner, EMLs can be used in relatively small optical devices, including small form factor transceivers that comply with the XFP standard. The XFP modules with EMLs can be used for longer links than XFPs without EMLs. In addition, EMLs can be stabilized using TECs so that XFP modules can be used for DWDM-type applications.

Abstract: A transistor header assembly for use in transmitter optical subassemblies of optical transceivers. The header assembly has a base with a platform extending through. The platform has a conductive trace extending through the platform for making connections on both sides of the base. A thermoelectric cooler (TEC) is used to dissipate heat from a laser within the header assembly. The TEC dissipates heat sufficiently to allow an externally modulated laser (EML) to be used in the header assembly. In this manner, EMLs can be used in relatively small optical devices, including small form factor transceivers that comply with the XFP standard. The XFP modules with EMLs can be used for longer links than XFPs without EMLs. In addition, EMLs can be stabilized using TECs so that XFP modules can be used for DWDM-type applications.

Abstract: An apparatus and method are provided for testing an optical subassembly of an optoelectronic device before attaching the electrical component. The method includes assembling a test circuit on a printed circuit board (“PCB”) and placing the PCB in the base portion of a clamping device. The optical subassembly is assembled and electrically connected to a flexible circuit. The clamping device is closed to form a temporary electrical connection between the flexible circuit and the test circuit. The flexible circuit is, in turn, connected to the optical subassembly. A data stream is transmitted through the optical subassembly and evaluated for compliance.

Abstract: A small form factor transceiver module that incorporates an externally modulated laser (EML). The transceiver module has a transmitter optical subassembly with a header assembly having a base with a platform extending through. The platform has a plurality of conductive traces extending through the platform for making connections on both sides of the base. A thermoelectric cooler (TEC) is used to dissipate heat from a laser within the header assembly. The TEC dissipates heat sufficiently to allow the EML to be used in the header assembly. In this manner, EMLs can be used in relatively small optical devices, including small form factor transceivers that comply with the XFP standard. The XFP modules with EMLs can be used for longer links than XFPs without EMLs. In addition, EMLs can be stabilized using TECs so that XFP modules can be used for DWDM-type applications.