Abstract: System and method for registering aerial and ground data including locating rigid features such as walls in both aerial and ground data, registering the ground rigid data to the aerial rigid data, and transforming the ground data using the transform from the registration, including breaking the data into sectors and aligning the sectors. Deformities in the ground data are accommodated.

Abstract: Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.

Abstract: System and method for registering aerial and ground data including locating rigid features such as walls in both aerial and ground data, registering the ground rigid data to the aerial rigid data, and transforming the ground data using the transform from the registration, including breaking the data into sectors and aligning the sectors. Deformities in the ground data are accommodated.

Abstract: A rack-mountable heat-exchanger for modular electronic systems is provided that include a heat exchanger including ambient air inlets and outlets forming an ambient airflow path in a first direction, and recirculating air inlets and outlets forming a recirculating airflow path in a second direction perpendicular to the first direction separated from the ambient airflow path; housing for an electronic device, the housing including internal air inlets and outlets forming an internal airflow path; a first duct configured to link the recirculating air outlet to the internal air inlet; a second duct configured to link the recirculating air inlet to the internal air outlet; and fan assemblies located one of the airflow path, configured to propel air through the heat exchanger in the respective airflow path.

Abstract: A rack-mountable heat-exchanger for modular electronic systems is provided that include a heat exchanger including ambient air inlets and outlets forming an ambient airflow path in a first direction, and recirculating air inlets and outlets forming a recirculating airflow path in a second direction perpendicular to the first direction separated from the ambient airflow path; housing for an electronic device, the housing including internal air inlets and outlets forming an internal airflow path; a first duct configured to link the recirculating air outlet to the internal air inlet; a second duct configured to link the recirculating air inlet to the internal air outlet; and fan assemblies located one of the airflow path, configured to propel air through the heat exchanger in the respective airflow path.

Abstract: Embodiments herein describe preventing a pluggable module from connecting to a chassis until ensuring there is no damage on the pluggable module, the chassis, or both. In one embodiment, the chassis includes a blocking element that prevents or blocks the pluggable module from mating with the chassis. The chassis can also include a camera for capturing an image of the pluggable module to determine whether there is damage to its connection elements (e.g., pins). If not, the chassis can release the locking pin to permit the pluggable module to mate with connection elements on the chassis.

Abstract: Systems and methods for lossy data compression using key artifacts and dynamically generated cycles are described, including receiving a data stream of relational data; detecting an artifact in the data stream associated with a critical point in the relational data; analyzing, by a processing device, the artifact to determine a set of artifacts associated with a complex event where the critical point is an endpoint of the complex event; calculating one or more cycle metrics based on the set of artifacts; generating a data structure associated with the complex event and cycle metrics; providing the data structure for marking a display of the relational data with the complex event based on the cycle metrics.

Abstract: In one embodiment, an apparatus includes an optical module, and a heat sink for attachment to an optical module cage configured for receiving the optical module, the heat sink having a surface in which recesses are formed. The optical module includes a thermal interface material attached to a surface of the optical module for thermal contact with the heat sink, and lifting elements extending from the surface. The lifting elements are configured to create a gap between the thermal interface material and the heat sink during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, and are positioned for insertion into aligned recesses in the heat sink when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the heat sink and the thermal interface material.

Abstract: In one embodiment, an apparatus includes a fan tray comprising a plurality of fans for cooling modules within a modular electronic system with airflow from a front of the modular electronic system to a back of the modular electronic system, and a hinge member for connecting the fan tray to a front panel of the modular electronic system with the fans positioned in front of the modules. The fan tray is rotatable on the hinge member for movement away from the front panel to allow for replacement of one of the modules.

Abstract: In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.

Abstract: An optical module includes a housing with a first end and a handle extending from the second end. A temperature indicator on the handle is thermally coupled to the housing to improve correlation with an optical module surface temperature. The temperature indicator provides an indication that the optical module surface temperature of the housing exceeds a predefined temperature limit.

Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes a mating surface. The TIM includes a first surface that is coupled to the mating surface and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a shape memory alloy (SMA) element. When the SMA element is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the SMA element moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

Abstract: In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.

Abstract: Embodiments presented in this disclosure generally relate to a ground device. More specifically, embodiments disclosed herein are directed to a grounding device for indicating whether there is proper grounding for electrical equipment. One embodiment presented in this disclosure provides an apparatus. The apparatus generally includes a lug configured to be coupled to a physical ground node, the lug having one or more bolts for coupling the lug to a surface of a plate such that the physical ground node is electrically coupled to an electrical ground node. The apparatus also includes a sensing circuit configured to detect whether the physical ground node is electrically coupled to the electrical ground node, and provide an indication of whether the physical ground node is electrically coupled to the electrical ground node based on the detection.

Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes a mating surface. The TIM includes a first surface that is coupled to the mating surface and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a shape memory alloy (SMA) element. When the SMA element is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the SMA element moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

Abstract: An optical module includes a housing with a first end and a handle extending from the second end. A temperature indicator on the handle is thermally coupled to the housing to improve correlation with an optical module surface temperature. The temperature indicator provides an indication that the optical module surface temperature of the housing exceeds a predefined temperature limit.

Abstract: In one embodiment, an apparatus includes an optical module comprising a first end for insertion into a network device and a second end extending from the network device when the optical module is inserted into the network device, and a temperature indicator thermally coupled to the optical module and extending from said second end of the optical module. The temperature indicator provides an indication that a surface temperature of the optical module exceeds a predefined safe touch temperature limit.

Abstract: A rack-mountable heat-exchanger for modular electronic systems is provided that include a heat exchanger including ambient air inlets and outlets forming an ambient airflow path in a first direction, and recirculating air inlets and outlets forming a recirculating airflow path in a second direction perpendicular to the first direction separated from the ambient airflow path; housing for an electronic device, the housing including internal air inlets and outlets forming an internal airflow path; a first duct configured to link the recirculating air outlet to the internal air inlet; a second duct configured to link the recirculating air inlet to the internal air outlet; and fan assemblies located one of the airflow path, configured to propel air through the heat exchanger in the respective airflow path.

Abstract: In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.

Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.