Patents by Inventor Devadas BHASKARAN

Devadas BHASKARAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resonance mitigation in RF high power amplifier enclosure
    Patent number: 10340856
    Abstract: Aspects of the present disclosure generally relate to a RF high power amplifier designed for resonance mitigation. A method for resonance mitigation in RF high power amplifier enclosure and an enclosure for RF high power amplifier designed to mitigate resonance is provided. In an aspect, the enclosure can be configured with a metallic post or a grounded metallic post positioned at a suitable location with RF high power amplifier circuit to dampen and shift out resonance. In an aspect, the metallic post can be placed between printed circuit board (PCB) substrate and enclosure lid. Proposed metallic post solution eliminates the need of RF absorber in the design.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: July 2, 2019
    Assignee: CENTRE FOR DEVELOPMENT OF TELEMATICS
    Inventors: Theepak Shoundrabalan, Vijaya Suresh Namburi, Selvapriya Radhakrishnan, Devadas Bhaskaran, Soundarakumar Masilamani, Vipin Tyagi
  • Resonance Mitigation In RF High Power Amplifier Enclosure
    Publication number: 20180041172
    Abstract: Aspects of the present disclosure generally relate to a RF high power amplifier designed for resonance mitigation. A method for resonance mitigation in RF high power amplifier enclosure and an enclosure for RF high power amplifier designed to mitigate resonance is provided. In an aspect, the enclosure can be configured with a metallic post or a grounded metallic post positioned at a suitable location with RF high power amplifier circuit to dampen and shift out resonance. In an aspect, the metallic post can be placed between printed circuit board (PCB) substrate and enclosure lid. Proposed metallic post solution eliminates the need of RF absorber in the design.
    Type: Application
    Filed: May 17, 2017
    Publication date: February 8, 2018
    Inventors: Theepak SHOUNDRABALAN, Vijaya Suresh NAMBURI, Selvapriya RADHAKRISHNAN, Devadas BHASKARAN, Soundarakumar MASILAMANI, Vipin TYAGI