Patents by Inventor Devarajan Ganesan

Devarajan Ganesan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal barrier for copper interconnects that incorporates silicon in the metal barrier or at the copper/metal barrier interface
    Publication number: 20020009880
    Abstract: A copper interconnect having a barrier layer (106, 206). A metal barrier layer may be co-deposited with Si to form barrier (106) or a metal barrier layer may be deposited followed by surface treatment with a Si-containing ambient to form barrier (206). The copper (110) is then deposited over the said barrier layer (106,206) with good adhesion.
    Type: Application
    Filed: March 30, 2001
    Publication date: January 24, 2002
    Inventors: Qing-Tang Jiang, Jiong-Ping Lu, Devarajan Ganesan