Patents by Inventor Devarshi Patel

Devarshi Patel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connector positioning system and method
    Patent number: 11990713
    Abstract: Apparatuses, systems, and methods to move end connectors. In at least one embodiment, a linkage system to move an end connector between at least a first position and a second position is driven by an actuator in a first direction to drive movement of the end connector in a second direction, perpendicular to the first direction.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: May 21, 2024
    Assignee: Nvidia Corporation
    Inventors: Ryan Albright, Devarshi Patel, Chris Fox, Mark White, Rajeev Jayavant, Susheela Narasimhan, Kelly McArthur, Ben Watkins
  • CONNECTOR POSITIONING SYSTEM AND METHOD
    Publication number: 20230129374
    Abstract: Apparatuses, systems, and methods to move end connectors. In at least one embodiment, a linkage system to move an end connector between at least a first position and a second position is driven by an actuator in a first direction to drive movement of the end connector in a second direction, perpendicular to the first direction.
    Type: Application
    Filed: October 25, 2021
    Publication date: April 27, 2023
    Inventors: Ryan Albright, Devarshi Patel, Chris Fox, Mark White, Rajeev Jayavant, Susheela Narasimhan, Kelly McArthur, Ben Watkins
  • Circuits and methods providing mutual capacitance in vertical electrical connections
    Patent number: 9722012
    Abstract: An electrical device including a structure having a plurality of dielectric layers, the structure further having a plurality of vertical electrical connections extending from a top layer of the dielectric layers to a bottom layer of the dielectric layers, a first vertical electrical connection of the plurality of vertical electrical connections including a first capacitive structure that extends in a plane perpendicular to a vertical dimension of the vertical electrical connection, wherein the first capacitive structure is disposed on a first dielectric layer of the plurality of dielectric layers, wherein the first dielectric layer is below the top layer, and a second vertical electrical connection of the plurality of vertical electrical connections including a second capacitive structure extending in the plane and disposed on the first dielectric layer.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: August 1, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Priyatharshan Pathmanathan, Devarshi Patel, Dennis Allen Northgrave, Kyle Roberts