Abstract: Disclosed herein are rapid radiation curable ink compositions that can cure at speeds that are greater than the speeds at which other commercially available ink compositions cure. The rapidly curing ink compositions advantageously display an increased cure speed, improved adhesion and solvent resistance when compared with other commercially available compositions. The ink compositions of the invention are substantially free of solvent, and include an ethylenically unsaturated hyperbranched oligomer having an average functionality of at least 6 per oligomer, a difunctional ethylenically unsaturated compound, and a photoinitiator. The ink compositions optionally include a surfactant and/or a vinyl amide monomer.

Abstract: Radiation curable and jettable ink compositions comprise ethylenically unsaturated oligomer and an ethylenically unsaturated monofunctional monomer. The compositions may optionally include additional ethylenically unsaturated polyfunctional component and/or chain transfer agent. The compositions have a viscosity at 25° C. of not greater than about 70 cPs and are radiation curable to form a cured ink having an elongation of at least 150%.

Abstract: The present invention relates to active energy beam curable low viscosity compositions and inks which exhibit a low initial viscosity and rapid cure. The compositions are free of epoxy monomer and include a vinyl ether component, a mono-acrylate component, or optionally a hybrid component containing both vinyl ether and acrylate functionality, a photocation polymerization initiator, and a free-radical photoinitiator. The radiation curable formulations are particularly suitable for inkjet ink for drop-on-demand printheads.

Abstract: Disclosed herein are ultra-thin thiol-ene coatings exhibiting optical clarity, scratch resistance, chemical resistance, and adhesion to a variety of substrate materials.