Abstract: An integrated circuit device may include an integrated circuit die coupled to a substrate, and a porous material on the die or a thermal interface material and extending beyond the edges of the die and over the substrate. An integrated circuit system may include a substrate with a power supply and an integrated circuit die, such that a porous material on the die extends over the substrate beyond a footprint of the die. A porous material may be formed on and beyond an edge of a received integrated circuit die coupled to a substrate or a thermal interface material on the die.

Abstract: A two-phase immersion cooling system for integrated circuit assembly may be formed utilizing a heat dissipation device thermally coupled to at least one integrated circuit device, wherein the heat dissipation device may include a surface enhancement structure and a boiling enhancement material layer, such as a micro-porous material, on the surface enhancement structure.

Abstract: Cold plates and liquid cooling systems for electronic devices are disclosed herein. An example cold plate includes a body defining a cavity. The body has an inlet opening and an outlet opening fluidically coupled to the cavity such that a fluid passageway is defined between the inlet opening and the outlet opening. The cold plate also includes metal foam in the cavity.

Abstract: Technologies for dynamic cooling include a computing device having a multi-chip package including multiple dies and a cold plate coupled to the multi-chip package. Micro nozzle valves are coupled to fluid passage zones of the cold plate positioned adjacent to the dies, and are configured to control fluid flow into the fluid passage zones. The computing device reads a predetermined die junction temperature for each die, determines a current die junction temperature for each die, compares the predetermined die junction temperature to the current die junction temperature for each die, and determines a fluid flow rate for each die based on that comparison. The computing device controls the micro nozzle valves adjacent to each die based on the respective fluid flow rate. The dies may include processor cores, field-programmable gate arrays, memory devices, or other computer chips. Other embodiments are described and claimed.

Abstract: Technologies for dynamic cooling include a computing device having a multi-chip package including multiple dies and a cold plate coupled to the multi-chip package. Micro nozzle valves are coupled to fluid passage zones of the cold plate positioned adjacent to the dies, and are configured to control fluid flow into the fluid passage zones. The computing device reads a predetermined die junction temperature for each die, determines a current die junction temperature for each die, compares the predetermined die junction temperature to the current die junction temperature for each die, and determines a fluid flow rate for each die based on that comparison. The computing device controls the micro nozzle valves adjacent to each die based on the respective fluid flow rate. The dies may include processor cores, field-programmable gate arrays, memory devices, or other computer chips. Other embodiments are described and claimed.

Abstract: A fluid routing device includes a fluid inlet, first vertical channels, a horizontal channel, a second vertical channel, and a fluid outlet. The first vertical channels are open to the fluid inlet. The horizontal channel is open to each of the first vertical channels. The first vertical channels are oriented to provide fluid coolant from the fluid inlet vertically down to the horizontal channel. The horizontal channel is open on one side such that fluid coolant in the horizontal channel directly contacts an apparatus attached to a bottom of the fluid routing device. The second vertical channel is open to the horizontal channel. The second vertical channel is oriented to provide fluid coolant vertically up away from the horizontal channel. The fluid outlet is open to the second vertical channel such that fluid coolant from the second vertical channel exits the fluid routing device through the fluid outlet.

Abstract: A heat management system may include a die package. The die package may include a housing. The housing may include a housing surface. The housing may include a housing inlet port. The housing inlet port may be in communication with the housing surface. The housing may include a housing outlet port. The housing outlet port may be in communication with the housing surface. The heat management system may include a manifold. The manifold may be configured to couple with the housing. The manifold may include a manifold surface. The manifold surface may be configured to mate with the housing surface. The manifold may include a manifold inlet port. The manifold inlet port may be in communication with the manifold surface. The manifold may include a manifold outlet port. The manifold outlet port may be in communication with the manifold surface.

Abstract: A heat management system may include a die package. The die package may include a housing. The housing may include a housing surface. The housing may include a housing inlet port. The housing inlet port may be in communication with the housing surface. The housing may include a housing outlet port. The housing outlet port may be in communication with the housing surface. The heat management system may include a manifold. The manifold may be configured to couple with the housing. The manifold may include a manifold surface. The manifold surface may be configured to mate with the housing surface. The manifold may include a manifold inlet port. The manifold inlet port may be in communication with the manifold surface. The manifold may include a manifold outlet port. The manifold outlet port may be in communication with the manifold surface.

Abstract: A fluid routing device includes a fluid inlet, first vertical channels, a horizontal channel, a second vertical channel, and a fluid outlet. The first vertical channels are open to the fluid inlet. The horizontal channel is open to each of the first vertical channels. The first vertical channels are oriented to provide fluid coolant from the fluid inlet vertically down to the horizontal channel. The horizontal channel is open on one side such that fluid coolant in the horizontal channel directly contacts an apparatus attached to a bottom of the fluid routing device. The second vertical channel is open to the horizontal channel. The second vertical channel is oriented to provide fluid coolant vertically up away from the horizontal channel. The fluid outlet is open to the second vertical channel such that fluid coolant from the second vertical channel exits the fluid routing device through the fluid outlet.

Abstract: In an embodiment, a drive system includes a transformer enclosed in an enclosure including a heat exchanger to cool a fluid medium. In addition, the system includes a plurality of power cubes each including a rectifier, a DC-link, and an inverter. Each power cube may include a plurality of cold plates each coupled to a corresponding switching device of the inverter, an inlet port in communication with a first one of the plurality of cold plates and an outlet port in communication with a last one of the plurality of cold plates. In turn, a manifold assembly is to couple at least the power cubes to enable two phase cooling of the power cubes and the transformer via one or more heat exchangers.

Abstract: In an embodiment, a drive system includes a transformer enclosed in an enclosure including a heat exchanger to cool a fluid medium. In addition, the system includes a plurality of power cubes each including a rectifier, a DC-link, and an inverter. Each power cube may include a plurality of cold plates each coupled to a corresponding switching device of the inverter, an inlet port in communication with a first one of the plurality of cold plates and an outlet port in communication with a last one of the plurality of cold plates. In turn, a manifold assembly is to couple at least the power cubes to enable two phase cooling of the power cubes and the transformer via one or more heat exchangers.