Patents by Inventor Devin Alexander Mourey
Devin Alexander Mourey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11597646Abstract: A device includes: a die including a microfluidic device; a polymer substrate formed around the die; and a separate fluid manifold attached to the polymer substrate over the die and on a same side of the substrate as the die, the manifold to deliver fluid to the die.Type: GrantFiled: July 26, 2016Date of Patent: March 7, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chien-Hua Chen, Devin Alexander Mourey, Michael W. Cumbie, Si-lam Choy
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Patent number: 11541659Abstract: In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.Type: GrantFiled: August 12, 2020Date of Patent: January 3, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Silam J Choy, Michael W Cumbie, Devin Alexander Mourey, Chien-Hua Chen
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Publication number: 20220297113Abstract: A method of manufacturing a digital dispense apparatus includes molding a monolithic carrier structure, forming cut outs into a planar top surface of the monolithic carrier structure, the cut outs including a reservoir extending into part of a thickness of the monolithic carrier structure and fluid routing to connect the reservoir with a fluid dispense device, and overmolding the fluid dispense device into the monolithic carrier structure on a side of the monolithic carrier structure that is opposite to the reservoir to fluidically connect to the fluid routing.Type: ApplicationFiled: June 9, 2022Publication date: September 22, 2022Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Jeffrey A. NIELSEN, Michael W. CUMBIE, Devin Alexander MOUREY, Silam J. CHOY, Kenneth WARD, Christie DUDENHOEFER
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Patent number: 11440009Abstract: A method may include etching a number of holes into a carrier wafer layer to form a plurality of filters in the carrier wafer layer, patterning a chamber layer over a first side of the carrier wafer layer to form chambers above each filter formed in the carrier wafer layer, forming a layer over the chamber layer, grinding a second side of the carrier wafer layer to expose the number of holes etched into the carrier wafer layer, and bonding a molded substrate to the carrier wafer layer opposite the chamber layer.Type: GrantFiled: July 15, 2016Date of Patent: September 13, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chien-Hua Chen, Michael W. Cumbie, Devin Alexander Mourey
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Patent number: 11440008Abstract: Examples include microfluidic devices. Example microfluidic devices comprise a microfluidic channel, a capillary chamber, and a fluidic actuator. The microfluidic channel is fluidly connected to the capillary chamber. The capillary chamber is to restrict flow of fluid therethrough. The fluidic actuator is positioned proximate the capillary chamber. The fluidic actuator is to actuate to thereby initiate flow of fluid through the capillary chamber.Type: GrantFiled: April 14, 2016Date of Patent: September 13, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Devin Alexander Mourey, Michael W Cumbie, Garrett E Clark
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Patent number: 11383230Abstract: A digital dispense apparatus includes at least one fluid dispense device, at least one reservoir fluidically connected to the at least one fluid dispense device, a monolithic carrier structure carrying the at least one fluid dispense device and reservoir, the monolithic carrier forming fluid routing between the reservoir and the fluid dispense device.Type: GrantFiled: March 31, 2016Date of Patent: July 12, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Jeffrey A. Nielsen, Michael W. Cumbie, Devin Alexander Mourey, Silam J. Choy, Kenneth Ward, Christie Dudenhoefer
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Patent number: 11364492Abstract: A digital dispense apparatus comprising a plurality of fluid dispense devices, at least one reservoir connected to the plurality of fluid dispense devices to deliver fluid to the plurality of fluid dispense devices, at least one contact pad array, and a single monolithic carrier structure.Type: GrantFiled: March 31, 2016Date of Patent: June 21, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Jeffrey A. Nielsen, Michael W. Cumbie, Devin Alexander Mourey, Silam J. Choy, Christie Dudenhoefer, Kenneth Ward
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Patent number: 11325378Abstract: In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.Type: GrantFiled: October 28, 2020Date of Patent: May 10, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Michael W. Cumbie, Devin Alexander Mourey, Chien-Hua Chen
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Patent number: 11326200Abstract: A method of preparing a sample may include depositing an aqueous solution comprising copies of a primer into a layer of hydrophobic liquid on a substrate with a thermal inkjet device. A sample may include: a substrate; a layer of hydrophobic liquid on the substrate, the layer of hydrophobic liquid comprising a plurality of droplets of aqueous solution distributed in the layer, wherein the plurality of droplets contain: primers; a polymerase enzyme; deoxynucleotide triphosphates (dNTPs); and a target sequence for replication; and a cover, the cover contacting and covering the layer of hydrophobic liquid.Type: GrantFiled: July 22, 2016Date of Patent: May 10, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Michael W. Cumbie, Devin Alexander Mourey, Si-Iam Choy
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Patent number: 11090929Abstract: A printhead may include a nozzle, a firing chamber fluidly coupled to the nozzle, a printing fluid slot fluidly coupled to the firing chamber, and a sensor to detect a plurality of complex impedance values of a printing fluid at the printhead over a plurality of frequencies and create a printing fluid signature of the printing fluid. A method of determining at least one characteristic of a printing fluid provided to a printhead ma include, with a number of sensors, applying an alternating current at a plurality of frequencies over time to the printing fluid to receive a plurality of complex impedance values and comparing the plurality of complex impedance signals to a number of stored signals.Type: GrantFiled: July 21, 2016Date of Patent: August 17, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chien-Hua Chen, Michael W. Cumbie, Devin Alexander Mourey
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Patent number: 11046084Abstract: In one example a liquid level sensing device is described. The device includes a carrier and a liquid level sensing device disposed on the carrier. The liquid level sensing interface has an aspect ratio of at least 1:50. A number of liquid level sensing components are disposed on the liquid level sensing interface. The number of liquid level sensing components detect a liquid level in a liquid container. The liquid level sensing device also includes an electrical interconnect to output data collected from the number of liquid level sensing components.Type: GrantFiled: April 21, 2016Date of Patent: June 29, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Michael W. Cumbie, Chien-Hua Chen, Devin Alexander Mourey, Anthony D. Studer
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Publication number: 20210039390Abstract: In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.Type: ApplicationFiled: October 28, 2020Publication date: February 11, 2021Inventors: Michael W. Cumbie, Devin Alexander Mourey, Chien-Hua Chen
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Publication number: 20200369031Abstract: In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.Type: ApplicationFiled: August 12, 2020Publication date: November 26, 2020Inventors: Silam J. Choy, Michael W. Cumbie, Devin Alexander Mourey, Chien-Hua Chen
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Patent number: 10836162Abstract: In example implementations, an apparatus with an interposer is provided. The apparatus may include an epoxy molded compound (EMC). A print head die and a drive integrated circuit (IC) may be embedded in the EMC. An interposer may also be embedded in the EMC. The print head die, the drive IC and the interposer may be wire bonded within the EMC.Type: GrantFiled: January 10, 2019Date of Patent: November 17, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventors: Michael W. Cumbie, Devin Alexander Mourey, Chien-Hua Chen
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Patent number: 10836169Abstract: In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.Type: GrantFiled: July 2, 2018Date of Patent: November 17, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventors: Silam J. Choy, Michael W. Cumbie, Devin Alexander Mourey, Chien-Hua Chen
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Patent number: 10815121Abstract: A composite wafer includes a first silicon die with a first top surface; and a polymer substrate with a top surface and a bottom surface. The silicon die is embedded in the polymer substrate such that the top surface of the substrate and the first top surface of the first silicon die are coplanar and the bottom surface of the polymer substrate is planar.Type: GrantFiled: July 12, 2016Date of Patent: October 27, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventors: Si-lam J. Choy, Chien-Hua Chen, Michael W. Cumbie, Devin Alexander Mourey
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Publication number: 20200331259Abstract: A printhead may include a nozzle, a firing chamber fluidly coupled to the nozzle, a printing fluid slot fluidly coupled to the firing chamber, and a sensor to detect a plurality of complex impedance values of a printing fluid at the printhead over a plurality of frequencies and create a printing fluid signature of the printing fluid. A method of determining at least one characteristic of a printing fluid provided to a printhead ma include, with a number of sensors, applying an alternating current at a plurality of frequencies over time to the printing fluid to receive a plurality of complex impedance values and comparing the plurality of complex impedance signals to a number of stored signals.Type: ApplicationFiled: July 21, 2016Publication date: October 22, 2020Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Chien-Hua CHEN, Michael W. CUMBIE, Devin Alexander Mourey
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Patent number: 10640369Abstract: One example provides a microelectromechanical systems (MEMS) device that includes a number of silicon die over-molded with an overmold material, a number of active areas formed on the silicon die, the active areas including at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor, and a fan-out layer coupled to the silicon die, the fan-out layer including a number of fluid channels formed therein that interface with active areas of the silicon die and allow the fluid to flow to the at least one sensor.Type: GrantFiled: July 13, 2016Date of Patent: May 5, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chien-Hua Chen, Devin Alexander Mourey, Michael W. Cumbie, Si-lam J. Choy
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Patent number: 10520440Abstract: Molecule sensing apparatus. The apparatus has first and second chambers, an input port extending into the first chamber, a fluid channel extending from the first chamber to the second chamber, and a surface-enhanced substrate in the second chamber.Type: GrantFiled: February 8, 2012Date of Patent: December 31, 2019Assignee: Hewlett-Packard Development Company, L.P.Inventors: Devin Alexander Mourey, James William Stasiak, James Elmer Abbott, Jr., Zhiyong Li
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Publication number: 20190366719Abstract: In an example, a method for making a fluid ejection apparatus may include forming a molding material over a fluid passage on a back surface of printhead die, embedding the printhead die in an encapsulant in a cavity in a printed circuit board such that at least one drop ejector of the printhead die is exposed at a front side of the printed circuit board, removing the encapsulant at a back side of the printed circuit board to expose the molding material, and removing the molding material to form a fluid feed slot through which fluid may flow to the fluid passage opening in the printhead die.Type: ApplicationFiled: August 14, 2019Publication date: December 5, 2019Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Chien-Hua Chen, Michael W. Cumbie, Devin Alexander Mourey