Patents by Inventor Devin Bingham

Devin Bingham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7378936
    Abstract: A circuit element has a substrate layer with first and second faces. A conductive first layer overlays the first surface, and a conductive second layer overlays the second surface. The first layer defines a pattern with a trimmable portion. The second layer defines a pattern having a first conductive element registered with at least a portion of the trimmable portion, and a second conductive element electrically isolated from first element and encompassing the first element. The second element may be a ground plane that has an aperture surrounding the first component, which serves as a shield to prevent damage to any elements beyond the second layer.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: May 27, 2008
    Assignee: Tektronix, Inc.
    Inventors: Devin Bingham, Daniel J. Ayres, Alvin Chow
  • Publication number: 20060290463
    Abstract: A circuit element has a substrate layer with first and second faces. A conductive first layer overlays the first surface, and a conductive second layer overlays the second surface. The first layer defines a pattern with a trimmable portion. The second layer defines a pattern having a first conductive element registered with at least a portion of the trimmable portion, and a second conductive element electrically isolated from first element and encompassing the first element. The second element may be a ground plane that has an aperture surrounding the first component, which serves as a shield to prevent damage to any elements beyond the second layer.
    Type: Application
    Filed: May 23, 2005
    Publication date: December 28, 2006
    Inventors: Devin Bingham, Daniel Ayres, Alvin Chow
  • Patent number: 6857898
    Abstract: Method and apparatus for launching a coaxial cable onto a circuit board is described. In an example, a circuit board includes a front edge and a major surface. The major surface includes a recessed portion open to the front edge, the recessed portion being defined by a stop surface, opposing side surfaces, and a bottom surface. A plurality of conductive pads is disposed on the major surface. A conductive layer is disposed on at least a portion of the bottom surface. The recessed portion is adapted to receive a multiple conductor ribbon cable to provide thereby low-profile communication of the multiple conductor ribbon cable and the circuit board. The multiple conductor ribbon cable having a plurality of first conductors and a plurality of second conductors respectively associated with the plurality of first conductors. The plurality of conductive pads are adapted to receive respective first conductors of the multiple conductor ribbon cable.
    Type: Grant
    Filed: July 24, 2003
    Date of Patent: February 22, 2005
    Assignee: Tektronix, Inc.
    Inventors: David T. Engquist, J. Steve Lyford, Devin Bingham
  • Publication number: 20040072468
    Abstract: Method and apparatus for launching a coaxial cable onto a circuit board is described. In an example, a circuit board includes a front edge and a major surface. The major surface includes a recessed portion open to the front edge, the recessed portion being defined by a stop surface, opposing side surfaces, and a bottom surface. A plurality of conductive pads is disposed on the major surface. A conductive layer is disposed on at least a portion of the bottom surface. The recessed portion is adapted to receive a multiple conductor ribbon cable to provide thereby low-profile communication of the multiple conductor ribbon cable and the circuit board. The multiple conductor ribbon cable having a plurality of first conductors and a plurality of second conductors respectively associated with the plurality of first conductors. The plurality of conductive pads are adapted to receive respective first conductors of the multiple conductor ribbon cable.
    Type: Application
    Filed: July 24, 2003
    Publication date: April 15, 2004
    Inventors: David T. Engquist, J. Steve Lyford, Devin Bingham