Patents by Inventor Devin G. Burt

Devin G. Burt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7868625
    Abstract: The slot interposer probe consists of a board with a male edge connector and a female edge connector connected to its opposed edges and circuitry electrically connecting the male edge connector to the female edge connector. The female edge connector may be a straddle-mount connector. The board may have an inner layer sandwiched between two outer layers. There may be a probe having a high-speed buffer connected to a plurality of capacitors, isolation resistors, and vias that intercepts signals carried by transmission lines on the inner layer. The vias may have a length equal to the inner layer's width. The high-speed buffer receives intercepted signals from the vias, copies and amplifies the signals, and drives them through coaxial cables to an acquisition module. The invention also includes a method of intercepting signals between a first electrical device and a second electrical device.
    Type: Grant
    Filed: May 15, 2008
    Date of Patent: January 11, 2011
    Assignee: Tektronix, Inc.
    Inventors: Devin G. Burt, Joshua J. O'Brien, David W. Koch, Roxann R. Jones
  • Publication number: 20090284268
    Abstract: The slot interposer probe consists of a board with a male edge connector and a female edge connector connected to its opposed edges and circuitry electrically connecting the male edge connector to the female edge connector. The female edge connector may be a straddle-mount connector. The board may have an inner layer sandwiched between two outer layers. There may be a probe having a high-speed buffer connected to a plurality of capacitors, isolation resistors, and vias that intercepts signals carried by transmission lines on the inner layer. The vias may have a length equal to the inner layer's width. The high-speed buffer receives intercepted signals from the vias, copies and amplifies the signals, and drives them through coaxial cables to an acquisition module. The invention also includes a method of intercepting signals between a first electrical device and a second electrical device.
    Type: Application
    Filed: May 15, 2008
    Publication date: November 19, 2009
    Applicant: TEKTRONIX, INC.
    Inventors: Devin G. Burt, Joshua J. O'Brien, David W. Koch, Roxann R. Jones