Abstract: A laser crafting apparatus for directing electromagnetic radiation toward a workpiece may include various features. For example, the laser crafting apparatus may include a material support tray that is removably supported within an internal volume of the laser crafting apparatus. Further, the apparatus may include pre-filter disposed in a ventilation pathway between a workspace region of the internal volume and an extractor fan. The laser crafting apparatus may include a laser carriage assembly that houses a laser module and the assembly may include a lens tray detachably coupled to the support structure of the laser carriage assembly. In various embodiments, the laser crafting apparatus includes a lid having a radiation attenuation layer and a fire suppression layer.

Abstract: A method of manufacturing a microfluidic system or microfluidic device having at least one channel includes providing a base sheet, providing a deformable intermediate layer, providing a cover film, and laminating the base sheet, the intermediate layer and the cover film so that a back surface of the intermediate layer is attached to a front surface of the base sheet and a back surface of the cover film is attached to a front surface of the intermediate layer opposite to the back surface thereof, thereby forming a laminate comprising the base sheet, the intermediate layer and the cover film. Further, the method includes applying pressure to the front surface of the intermediate layer through the cover film so as to deform the intermediate layer, thereby forming the at least one channel. The invention also relates to a microfluidic system or microfluidic device) manufactured by this method.

Abstract: A device chip for mounting on a board is provided. The device chip includes a top surface, an undersurface located on an opposite side from the top surface and having a larger area than the top surface, a slope inclined with respect to the top surface and the undersurface and exposed to the top surface side, a circuit portion on the top surface side, the circuit portion including an electronic circuit, and a wiring portion on which wiring electrically connecting the circuit portion and the board to each other is to be formed, the wiring portion including the slope in a part of the wiring portion.

Abstract: A device chip for mounting on a board is provided. The device chip includes a top surface, an undersurface located on an opposite side from the top surface and having a larger area than the top surface, a slope inclined with respect to the top surface and the undersurface and exposed to the top surface side, a circuit portion on the top surface side, the circuit portion including an electronic circuit, and a wiring portion on which wiring electrically connecting the circuit portion and the board to each other is to be formed, the wiring portion including the slope in a part of the wiring portion.

Abstract: A method of manufacturing a microfluidic system or microfluidic device having at least one channel includes providing a base sheet, providing a deformable intermediate layer, providing a cover film, and laminating the base sheet, the intermediate layer and the cover film so that a back surface of the intermediate layer is attached to a front surface of the base sheet and a back surface of the cover film is attached to a front surface of the intermediate layer opposite to the back surface thereof, thereby forming a laminate comprising the base sheet, the intermediate layer and the cover film. Further, the method includes applying pressure to the front surface of the intermediate layer through the cover film so as to deform the intermediate layer, thereby forming the at least one channel. The invention also relates to a microfluidic system or microfluidic device) manufactured by this method.

Abstract: The present invention provides non-venting transfer systems and methods related to transferring cryogenic liquid between two vessels without venting evaporated cryogenic liquid into the atmosphere. The stations, systems, and methods utilize a feed line and a return line connecting a source tank and a pump system to allow for flow of a cryogenic liquid to the pump and return of evaporated cryogenic liquid to the source tank, thereby avoiding release of the evaporated cryogenic liquid into the atmosphere.

Abstract: The present invention provides non-venting transfer systems and methods related to transferring cryogenic liquid between two vessels without venting evaporated cryogenic liquid into the atmosphere. The stations, systems, and methods utilize a feed line and a return line connecting a source tank and a pump system to allow for flow of a cryogenic liquid to the pump and return of evaporated cryogenic liquid to the source tank, thereby avoiding release of the evaporated cryogenic liquid into the atmosphere.

Abstract: A MEMS device chip manufacturing method including a grinding step of grinding a device forming area of a wafer to thereby form a recess and an annular reinforcing portion surrounding the recess, a MEMS device forming step of performing any processing including etching to the wafer after performing the grinding step to thereby form a plurality of MEMS devices partitioned by a plurality of crossing division lines in the device forming area, and a dividing step of dividing the wafer along the division lines after performing the MEMS device forming step to thereby manufacture a plurality of MEMS device chips.

Abstract: A MEMS device chip manufacturing method including a grinding step of grinding a device forming area of a wafer to thereby form a recess and an annular reinforcing portion surrounding the recess, a MEMS device forming step of performing any processing including etching to the wafer after performing the grinding step to thereby form a plurality of MEMS devices partitioned by a plurality of crossing division lines in the device forming area, and a dividing step of dividing the wafer along the division lines after performing the MEMS device forming step to thereby manufacture a plurality of MEMS device chips.

Abstract: The present invention provides non-venting transfer systems and methods related to transferring cryogenic liquid between two vessels without venting evaporated cryogenic liquid into the atmosphere. The stations, systems, and methods utilize a feed line and a return line connecting a source tank and a pump system to allow for flow of a cryogenic liquid to the pump and return of evaporated cryogenic liquid to the source tank, thereby avoiding release of the evaporated cryogenic liquid into the atmosphere.

Abstract: A dispenser nitrogen purge and heater system for a liquid natural gas (LNG) fueling dispenser, comprising a nitrogen purge enclosure; a nitrogen container containing nitrogen; a nitrogen feed line for feeding nitrogen from the nitrogen container to the nitrogen purge enclosure; a heater for heating an interior space within the enclosure; and a fan assembly for circulating the nitrogen within the interior space

Abstract: A processing method for a bump-included device wafer which includes an adhesive providing step of providing an adhesive in an annular groove of a carrier wafer so that the adhesive projects from the upper surface of an annular projection of the carrier wafer; a wafer attaching step of attaching and fixing the front side of the device wafer through the adhesive to the front side of the carrier wafer so as to accommodate bumps in a recess of the carrier wafer after performing the adhesive providing step; and a thickness reducing step of grinding or polishing the back side of the device wafer to reduce the thickness of the device wafer to a predetermined thickness after performing the wafer attaching step.

Abstract: A processing method for a bump-included device wafer which includes an adhesive providing step of providing an adhesive in an annular groove of a carrier wafer so that the adhesive projects from the upper surface of an annular projection of the carrier wafer; a wafer attaching step of attaching and fixing the front side of the device wafer through the adhesive to the front side of the carrier wafer so as to accommodate bumps in a recess of the carrier wafer after performing the adhesive providing step; and a thickness reducing step of grinding or polishing the back side of the device wafer to reduce the thickness of the device wafer to a predetermined thickness after performing the wafer attaching step.

Abstract: A method of processing a device wafer includes the carrier wafer preparing step of preparing a carrier wafer including an excessive carrier region on a surface thereof which is disposed in a position corresponding to an excessive outer circumferential region on a surface of the device wafer, the recess forming step of forming a recess in the excessive carrier region the carrier wafer, after the recess forming step, the adhesive placing step of placing an adhesive in the recess so as to project from the surface of the carrier wafer, after the adhesive placing step, the wafer bonding step of bonding the surface of the carrier wafer and the surface of the device wafer to each other, thereby securing the device wafer to the carrier wafer with the adhesive, and after the wafer bonding step, the thinning step of thinning the device wafer to a predetermined thickness by grinding or polishing a reverse side of the device wafer.

Abstract: A method of processing a device wafer includes the carrier wafer preparing step of preparing a carrier wafer including an excessive carrier region on a surface thereof which is disposed in a position corresponding to an excessive outer circumferential region on a surface of the device wafer, the recess forming step of forming a recess in the excessive carrier region the carrier wafer, after the recess forming step, the adhesive placing step of placing an adhesive in the recess so as to project from the surface of the carrier wafer, after the adhesive placing step, the wafer bonding step of bonding the surface of the carrier wafer and the surface of the device wafer to each other, thereby securing the device wafer to the carrier wafer with the adhesive, and after the wafer bonding step, the thinning step of thinning the device wafer to a predetermined thickness by grinding or polishing a reverse side of the device wafer.

Abstract: Disclosed herein is a method for enabling turn down of a turbine engine, comprising: extracting compressor discharge air from a working fluid path before it enters a combustion zone of the turbine engine; and reintroducing the extracted air to the working fluid path downstream of a combustor exit. Further disclosed herein is an apparatus related to a gas turbine, comprising: a compressor section, one or more combustors downstream from the compressor section, a turbine section downstream from the compressor section; and at least one conduit for extracting compressor discharge air from a working fluid path prior to a combustion zone and reintroducing the extracted air to the working fluid path downstream of a combustor exit in response to the turbine being in a turned down condition.

Abstract: Third stage turbine buckets have airfoil profiles substantially in accordance with Cartesian coordinate values of X, Y and Z set forth Table I wherein X and Y values are in inches and the Z values are non-dimensional values from 0 to 1 convertible to Z distances in inches by multiplying the Z values by the height of the airfoil in inches. The X, Y and Z distances may be scalable as a function of the same constant or number to provide a scaled up or scaled down airfoil section for the bucket. The nominal airfoil given by the X, Y and Z distances lies within an envelop of ±0.160 inches in directions normal to the surface of the airfoil.