Patents by Inventor Devin Mourey

Devin Mourey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printhead assembly
    Patent number: 11117376
    Abstract: A printhead assembly may include a first set of distinct parallel printhead dies in a second set of distinct parallel printhead dies. The first set of distinct parallel printhead dies may have respective major dimensions extending in a longitudinal direction and respective ends that are aligned in a transverse direction. The second set of distinct parallel printhead dies may have respective major dimensions extending in the longitudinal direction and respective ends aligned in the transverse direction. The second set of distinct parallel printhead dies may partially overlap the first set of distinct parallel printhead dies in the transverse direction.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: September 14, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Si-lam J. Choy, Devin Mourey, Eric L. Nikkel
  • PRINTHEAD ASSEMBLY
    Publication number: 20190118535
    Abstract: A printhead assembly may include a first set of distinct parallel printhead dies in a second set of distinct parallel printhead dies. The first set of distinct parallel printhead dies may have respective major dimensions extending in a longitudinal direction and respective ends that are aligned in a transverse direction. The second set of distinct parallel printhead dies may have respective major dimensions extending in the longitudinal direction and respective ends aligned in the transverse direction. The second set of distinct parallel printhead dies may partially overlap the first set of distinct parallel printhead dies in the transverse direction.
    Type: Application
    Filed: December 20, 2018
    Publication date: April 25, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Silam J. Choy, Devin Mourey, Eric L. Nikkel
  • Printhead assembly
    Patent number: 10195852
    Abstract: In one example, a printhead assembly includes a molding with multiple printhead dies exposed at a front part of the molding and channels in a back part of the molding to carry printing fluid to the dies. The printhead assembly also includes a printed circuit board affixed to the back part of the molding, not covering any of the channels, and an electrical connection between each die and the printed circuit board.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: February 5, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Silam J Choy, Devin Mourey, Eric L Nikkel
  • PRINTHEAD ASSEMBLY
    Publication number: 20170266973
    Abstract: In one example, a printhead assembly includes a molding with multiple printhead dies exposed at a front part of the molding and channels in a back part of the molding to carry printing fluid to the dies. The printhead assembly also includes a printed circuit board affixed to the back part of the molding, not covering any of the channels, and an electrical connection between each die and the printed circuit board.
    Type: Application
    Filed: August 28, 2014
    Publication date: September 21, 2017
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Silam J Choy, Devin Mourey, Eric L Nikkel