Abstract: Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

Abstract: Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

Abstract: A surface enhanced luminescence analyte interrogation stage may include a substrate and an array of pillars projecting from the substrate. Each of the pillars may include a polymeric post formed from a first material and a cap on the polymeric post. The cap has a plasmonic surface and is formed from a second material different than the first. A sacrificial coating covers the cap of each of the pillars.

Abstract: Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

Abstract: A printhead assembly may include a first set of distinct parallel printhead dies in a second set of distinct parallel printhead dies. The first set of distinct parallel printhead dies may have respective major dimensions extending in a longitudinal direction and respective ends that are aligned in a transverse direction. The second set of distinct parallel printhead dies may have respective major dimensions extending in the longitudinal direction and respective ends aligned in the transverse direction. The second set of distinct parallel printhead dies may partially overlap the first set of distinct parallel printhead dies in the transverse direction.

Abstract: A surface enhanced luminescence analyte interrogation stage may include a substrate and an array of pillars projecting from the substrate. Each of the pillars may include a polymeric post formed from a first material and a cap on the polymeric post. The cap has a plasmonic surface and is formed from a second material different than the first. A sacrificial coating covers the cap of each of the pillars.

Abstract: An apparatus may include a frame layer having a recess, a substrate secured to the frame layer at least partially across the recess and a surface enhanced luminescence (SEL) stage supported by the substrate within the recess.

Abstract: A housing may include sidewalls and a base extending between and supported by the sidewalls. The base and the sidewalls form a cavity. The housing support they substrate. The substrate supports a surface enhanced luminescence stage between the substrate and the base.

Abstract: Examples include a plastic-based support substrate and at least one fluid ejection die coupled thereto. The at least one fluid ejection die comprises a nozzles for dispensing printing material. The plastic-based support substrate has a fluid communication channel formed therethrough, where the fluid communication channel is in fluid communication with the nozzles of the at least one fluid ejection die.

Abstract: A housing may include sidewalls and a base extending between and supported by the sidewalls. The base and the sidewalls form a cavity. The housing support they substrate. The substrate supports a surface enhanced luminescence stage between the substrate and the base.

Abstract: An apparatus may include a frame layer having a recess, a substrate secured to the frame layer at least partially across the recess and a surface enhanced luminescence (SEL) stage supported by the substrate within the recess.

Abstract: A printhead assembly may include a first set of distinct parallel printhead dies in a second set of distinct parallel printhead dies. The first set of distinct parallel printhead dies may have respective major dimensions extending in a longitudinal direction and respective ends that are aligned in a transverse direction. The second set of distinct parallel printhead dies may have respective major dimensions extending in the longitudinal direction and respective ends aligned in the transverse direction. The second set of distinct parallel printhead dies may partially overlap the first set of distinct parallel printhead dies in the transverse direction.

Abstract: In an embodiment, a printhead includes a fluidic die molded into a moldable material. The die has a front surface exposed outside the moldable material to dispense fluid and an opposing back surface covered by the moldable material except at a channel in the moldable material through which fluid may pass directly to the back surface. The die has a first bond pad on the front surface surrounded by a first dam to prevent the moldable material from contacting the first bond pad.

Abstract: In one example, a printhead assembly includes a molding with multiple printhead dies exposed at a front part of the molding and channels in a back part of the molding to carry printing fluid to the dies. The printhead assembly also includes a printed circuit board affixed to the back part of the molding, not covering any of the channels, and an electrical connection between each die and the printed circuit board.

Abstract: Examples include a plastic-based support substrate and at least one fluid ejection die coupled thereto. The at least one fluid ejection die comprises a nozzles for dispensing printing material. The plastic-based support substrate has a fluid communication channel formed therethrough, where the fluid communication channel is in fluid communication with the nozzles of the at least one fluid ejection die.

Abstract: Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

Abstract: In an embodiment, a printhead includes a fluidic die molded into a moldable material. The die has a front surface exposed outside the moldable material to dispense fluid and an opposing back surface covered by the moldable material except at a channel in the moldable material through which fluid may pass directly to the back surface. The die has a first bond pad on the front surface surrounded by a first dam to prevent the moldable material from contacting the first bond pad.

Abstract: In an embodiment, a printhead includes a printhead die molded into a molding. The die has a front surface exposed outside the molding to dispense fluid and an opposing back surface covered by the molding except at a channel in the molding through which fluid may pass directly to the back surface. The die has a first bond pad on the front surface surrounded by a first dam to prevent the molding from contacting the first bond pad.

Abstract: In one example, a printhead assembly includes a molding with multiple printhead dies exposed at a front part of the molding and channels in a back part of the molding to carry printing fluid to the dies. The printhead assembly also includes a printed circuit board affixed to the back part of the molding, not covering any of the channels, and an electrical connection between each die and the printed circuit board.

Abstract: In an embodiment, a printhead includes a printhead die molded into a molding. The die has a front surface exposed outside the molding to dispense fluid and an opposing back surface covered by the molding except at a channel in the molding through which fluid may pass directly to the back surface. The die has a first bond pad on the front surface surrounded by a first dam to prevent the molding from contacting the first bond pad.