Patents by Inventor Devin Robert Sheridan

Devin Robert Sheridan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a semiconductor device having conductive bumps without using gold
    Patent number: 6489229
    Abstract: A semiconductor device (10) includes a solder bump (40) that is formed using a gold-free under-bump metallurgy (UBM) (21). In a preferred embodiment, UBM (21) includes a diffusion barrier layer (22) of chromium and a metallic layer (24) of copper. The bump layer metallurgy (31) is deposited directly on the metallic layer, without an intervening gold layer. To overcome problems associated with a native oxide layer (26) which forms on the metallic layer, especially on copper, the bump metallurgy includes a seed layer (32) of tin that is deposited prior to a bulk lead layer (34). The bump metallurgy includes a final metallic layer (36) having sufficient tin to make a bump having approximately 97% Pb and 3% tin.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: December 3, 2002
    Assignee: Motorola, Inc.
    Inventors: Devin Robert Sheridan, Larry J. Larsen, Martie D. Knauss