Patents by Inventor Devin SCHMITT

Devin SCHMITT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical planarization pads with constant groove volume
    Patent number: 11938584
    Abstract: A chemical mechanical polishing pad includes a surface portion of a first material. The surface portion includes a plurality of grooves. A first portion of the grooves are exposed grooves located at a surface of the chemical mechanical polishing pad. A second portion of the grooves are buried grooves embedded below the surface of the chemical mechanical polishing pad, such that, during use of the chemical mechanical polishing pad, one or more of the buried grooves are exposed at the surface.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: March 26, 2024
    Assignee: CMC MATERIALS LLC
    Inventors: Paul Andre Lefevre, Devin Schmitt, Jaeseok Lee, Eric S. Moyer, Holland Hodges
  • EFFECT PIGMENTS HAVING A REFLECTIVE CORE
    Publication number: 20230287219
    Abstract: The present invention relates to an effect pigment having optically active layers consisting of a flake of a highly reflective material with directly adjacent on one side or on both sides a layer of a semiconducting material having a bandgap of 0.1 to 3.5 eV. The effect pigment may be further coated with a coating which is optically non-active in the visible wavelength region.
    Type: Application
    Filed: June 21, 2021
    Publication date: September 14, 2023
    Inventor: Devin Schmitt
  • CHEMICAL MECHANICAL PLANARIZATION PADS WITH CONSTANT GROOVE VOLUME
    Publication number: 20200353588
    Abstract: A chemical mechanical polishing pad includes a surface portion of a first material. The surface portion includes a plurality of grooves. A first portion of the grooves are exposed grooves located at a surface of the chemical mechanical polishing pad. A second portion of the grooves are buried grooves embedded below the surface of the chemical mechanical polishing pad, such that, during use of the chemical mechanical polishing pad, one or more of the buried grooves are exposed at the surface.
    Type: Application
    Filed: May 7, 2020
    Publication date: November 12, 2020
    Inventors: Paul Andre LEFEVRE, Devin SCHMITT, Jaeseok LEE, Eric S. MOYER, Holland HODGES