Patents by Inventor Devin SNELL

Devin SNELL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10872284
    Abstract: A smartcard includes contact pads for electrical connection to an external power source for provision of power to the smartcard in a contact mode of the smartcard, a contactless power harvesting system for provision of power to the smartcard in a contactless mode of the smartcard, and a main circuit on-board the smartcard for receiving and managing the power provided from the contact pads or from the contactless power harvesting system, where the main circuit includes components requiring power in order to provide the smartcard with required functionality, and where the main circuit is connected to the contact pads via a current limiting circuit for controlling the levels of current drawn via the contact pads, the current limiting circuit having an integrator.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: December 22, 2020
    Assignee: ZWIPE AS
    Inventors: Jørgen Frandsen, Devin Snell
  • Patent number: 10726321
    Abstract: A method of manufacturing a smartcard may include providing a flexible smartcard circuit, forming conductive extension members on and extend away from the flexible circuit from a high melting point solder material, and laminating the flexible circuit to form a smartcard body. A cavity is then milled in the smartcard body to expose the ends of the extension members, and a contact pad is inserted into the cavity and electrically connected to extension members using a low melting temperature tin-bismuth solder using ultrasonically soldering, so as to avoid heat damage to the card body.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: July 28, 2020
    Assignee: Zwipe AS
    Inventors: Devin Snell, Jose Ignacio Wintergerst Lavin
  • Publication number: 20200005108
    Abstract: A smartcard (102) comprises contact pads for electrical connection to an external power source for provision of power to the smartcard in a contact mode of the smartcard; a contactless power harvesting system (108, 126) for provision of power to the smartcard in a contactless mode of the smartcard; and a main circuit on-board the smartcard for receiving and managing the power provided from the contact pads or from the contactless power harvesting system wherein the main circuit includes components requiring power in order to provide the smartcard with required functionality; and wherein the main circuit is connected to the contact pads via a current limiting circuit (C) for controlling the levels of current drawn via the contact pads, the current limiting circuit comprising an integrator.
    Type: Application
    Filed: March 1, 2018
    Publication date: January 2, 2020
    Inventors: Jørgen FRANDSEN, Devin SNELL
  • Publication number: 20190102665
    Abstract: A method of manufacturing a smartcard includes providing a flexible circuit having contacts for connection to a contact pad, wherein a secure element is electrically connected to the flexible circuit, electrically connecting contacts on the contact pad to the contacts on a flexible circuit via conductive paths through an extension block. A lamination process is applied to the flexible circuit to provide a card body enclosing the flexible circuit.
    Type: Application
    Filed: March 24, 2017
    Publication date: April 4, 2019
    Inventors: Devin SNELL, Jose Ignacio Wintergerst LAVIN
  • Publication number: 20190102662
    Abstract: A method of manufacturing a smartcard may include providing a flexible smartcard circuit, forming conductive extension members on and extend away from the flexible circuit from a high melting point solder material, and laminating the flexible circuit to form a smartcard body. A cavity is then milled in the smartcard body to expose the ends of the extension members, and a contact pad is inserted into the cavity and electrically connected to extension members using a low melting temperature tin-bismuth solder using ultrasonically soldering, so as to avoid heat damage to the card body.
    Type: Application
    Filed: September 12, 2016
    Publication date: April 4, 2019
    Inventors: Devin SNELL, Jose Ignacio Wintergerst LAVIN