Patents by Inventor Devis Contarato
Devis Contarato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10778925Abstract: A multiple-column-per-channel image CCD sensor utilizes a multiple-column-per-channel readout circuit including connected transfer gates that alternately transfer pixel data (charges) from a group of adjacent pixel columns to a shared output circuit at high speed with low noise. Charges transferred along the adjacent pixel columns at a line clock rate are alternately passed by the transfer gates to a summing gate that is operated at multiple times the line clock rate to pass the image charges to the shared output circuit. A symmetrical fork-shaped diffusion is utilized in one embodiment to merge the image charges from the group of related pixel columns. A method of driving the multiple-column-per-channel CCD sensor with line clock synchronization is also described. A method of inspecting a sample using the multiple-column-per-channel CCD sensor is also described.Type: GrantFiled: June 12, 2019Date of Patent: September 15, 2020Assignee: KLA-Tencor CorporationInventors: Yung-Ho Alex Chuang, Jingjing Zhang, Sharon Zamek, John Fielden, Devis Contarato, David L. Brown
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Patent number: 10764527Abstract: A dual-column-parallel image CCD sensor utilizes a dual-column-parallel readout circuit including two pairs of cross-connected transfer gates to alternately transfer pixel data (charges) from a pair of adjacent pixel columns to a shared output circuit at high speed with low noise. Charges transferred along the two adjacent pixel columns at a line clock rate are alternately passed by the transfer gates to a summing gate that is operated at twice the line clock rate to pass the image charges to the shared output circuit. A symmetrical Y-shaped diffusion is utilized in one embodiment to merge the image charges from the two pixel columns. A method of driving the dual-column-parallel CCD sensor with line clock synchronization is also described. A method of inspecting a sample using the dual-column-parallel CCD sensor is also described.Type: GrantFiled: April 29, 2019Date of Patent: September 1, 2020Assignee: KLA-Tencor CorporationInventors: Yung-Ho Alex Chuang, Jingjing Zhang, Sharon Zamek, John Fielden, Devis Contarato, David L. Brown
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Patent number: 10466212Abstract: A scanning electron microscope incorporates a multi-pixel solid-state electron detector. The multi-pixel solid-state detector may detect back-scattered and/or secondary electrons. The multi-pixel solid-state detector may incorporate analog-to-digital converters and other circuits. The multi-pixel solid state detector may be capable of approximately determining the energy of incident electrons and/or may contain circuits for processing or analyzing the electron signals. The multi-pixel solid state detector is suitable for high-speed operation such as at a speed of about 100 MHz or higher. The scanning electron microscope may be used for reviewing, inspecting or measuring a sample such as unpatterned semiconductor wafer, a patterned semiconductor wafer, a reticle or a photomask. A method of reviewing or inspecting a sample is also described.Type: GrantFiled: August 2, 2017Date of Patent: November 5, 2019Assignee: KLA—Tencor CorporationInventors: David L. Brown, Yung-Ho Alex Chuang, John Fielden, Marcel Trimpl, Jingjing Zhang, Devis Contarato, Venkatraman Iyer
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Patent number: 10462391Abstract: An inspection system and methods in which analog image data values (charges) captured by an image sensor are binned (combined) before or while being transmitted as output signals on the image sensor's output sensing nodes (floating diffusions), and in which an ADC is controlled to sequentially generate multiple corresponding digital image data values between each reset of the output sensing nodes. According to an output binning method, the image sensor is driven to sequentially transfer multiple charges onto the output sensing nodes between each reset, and the ADC is controlled to convert the incrementally increasing output signal after each charge is transferred onto the output sensing node. According to a multi-sampling method, multiple charges are vertically or horizontally binned (summed/combined) before being transferred onto the output sensing node, and the ADC samples each corresponding output signal multiple times. The output binning and multi-sampling methods may be combined.Type: GrantFiled: July 14, 2016Date of Patent: October 29, 2019Assignee: KLA-Tencor CorporationInventors: Yung-Ho Alex Chuang, David L. Brown, Devis Contarato, John Fielden, Daniel I. Kavaldjiev, Guoheng Zhao, Jehn-Huar Chern, Guowu Zheng, Donald W. Pettibone, Stephen Biellak
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Publication number: 20190313044Abstract: A multiple-column-per-channel image CCD sensor utilizes a multiple-column-per-channel readout circuit including connected transfer gates that alternately transfer pixel data (charges) from a group of adjacent pixel columns to a shared output circuit at high speed with low noise. Charges transferred along the adjacent pixel columns at a line clock rate are alternately passed by the transfer gates to a summing gate that is operated at multiple times the line clock rate to pass the image charges to the shared output circuit. A symmetrical fork-shaped diffusion is utilized in one embodiment to merge the image charges from the group of related pixel columns. A method of driving the multiple-column-per-channel CCD sensor with line clock synchronization is also described. A method of inspecting a sample using the multiple-column-per-channel CCD sensor is also described.Type: ApplicationFiled: June 12, 2019Publication date: October 10, 2019Inventors: Yung-Ho Alex Chuang, Jingjing Zhang, Sharon Zamek, John Fielden, Devis Contarato, David L. Brown
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Publication number: 20190253652Abstract: A dual-column-parallel image CCD sensor utilizes a dual-column-parallel readout circuit including two pairs of cross-connected transfer gates to alternately transfer pixel data (charges) from a pair of adjacent pixel columns to a shared output circuit at high speed with low noise. Charges transferred along the two adjacent pixel columns at a line clock rate are alternately passed by the transfer gates to a summing gate that is operated at twice the line clock rate to pass the image charges to the shared output circuit. A symmetrical Y-shaped diffusion is utilized in one embodiment to merge the image charges from the two pixel columns. A method of driving the dual-column-parallel CCD sensor with line clock synchronization is also described. A method of inspecting a sample using the dual-column-parallel CCD sensor is also described.Type: ApplicationFiled: April 29, 2019Publication date: August 15, 2019Inventors: Yung-Ho Alex Chuang, Jingjing Zhang, Sharon Zamek, John Fielden, Devis Contarato, David L. Brown
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Patent number: 10313622Abstract: A dual-column-parallel image CCD sensor utilizes a dual-column-parallel readout circuit including two pairs of cross-connected transfer gates to alternately transfer pixel data (charges) from a pair of adjacent pixel columns to a shared output circuit at high speed with low noise. Charges transferred along the two adjacent pixel columns at a line clock rate are alternately passed by the transfer gates to a summing gate that is operated at twice the line clock rate to pass the image charges to the shared output circuit. A symmetrical Y-shaped diffusion is utilized in one embodiment to merge the image charges from the two pixel columns. A method of driving the dual-column-parallel CCD sensor with line clock synchronization is also described. A method of inspecting a sample using the dual-column-parallel CCD sensor is also described.Type: GrantFiled: October 28, 2016Date of Patent: June 4, 2019Assignee: KLA-Tencor CorporationInventors: Yung-Ho Alex Chuang, Jingjing Zhang, Sharon Zamek, John Fielden, Devis Contarato, David L. Brown
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Publication number: 20170329025Abstract: A scanning electron microscope incorporates a multi-pixel solid-state electron detector. The multi-pixel solid-state detector may detect back-scattered and/or secondary electrons. The multi-pixel solid-state detector may incorporate analog-to-digital converters and other circuits. The multi-pixel solid state detector may be capable of approximately determining the energy of incident electrons and/or may contain circuits for processing or analyzing the electron signals. The multi-pixel solid state detector is suitable for high-speed operation such as at a speed of about 100 MHz or higher. The scanning electron microscope may be used for reviewing, inspecting or measuring a sample such as unpatterned semiconductor wafer, a patterned semiconductor wafer, a reticle or a photomask. A method of reviewing or inspecting a sample is also described.Type: ApplicationFiled: August 2, 2017Publication date: November 16, 2017Inventors: David L. Brown, Yung-Ho Alex Chuang, John Fielden, Marcel Trimpl, Jingjing Zhang, Devis Contarato, Venkatraman Iyer
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Publication number: 20170295334Abstract: A dual-column-parallel image CCD sensor utilizes a dual-column-parallel readout circuit including two pairs of cross-connected transfer gates to alternately transfer pixel data (charges) from a pair of adjacent pixel columns to a shared output circuit at high speed with low noise. Charges transferred along the two adjacent pixel columns at a line clock rate are alternately passed by the transfer gates to a summing gate that is operated at twice the line clock rate to pass the image charges to the shared output circuit. A symmetrical Y-shaped diffusion is utilized in one embodiment to merge the image charges from the two pixel columns. A method of driving the dual-column-parallel CCD sensor with line clock synchronization is also described. A method of inspecting a sample using the dual-column-parallel CCD sensor is also described.Type: ApplicationFiled: October 28, 2016Publication date: October 12, 2017Inventors: Yung-Ho Alex Chuang, Jingjing Zhang, Sharon Zamek, John Fielden, Devis Contarato, David L. Brown
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Patent number: 9767986Abstract: A scanning electron microscope incorporates a multi-pixel solid-state electron detector. The multi-pixel solid-state detector may detect back-scattered and/or secondary electrons. The multi-pixel solid-state detector may incorporate analog-to-digital converters and other circuits. The multi-pixel solid state detector may be capable of approximately determining the energy of incident electrons and/or may contain circuits for processing or analyzing the electron signals. The multi-pixel solid state detector is suitable for high-speed operation such as at a speed of about 100 MHz or higher. The scanning electron microscope may be used for reviewing, inspecting or measuring a sample such as unpatterned semiconductor wafer, a patterned semiconductor wafer, a reticle or a photomask. A method of reviewing or inspecting a sample is also described.Type: GrantFiled: August 25, 2015Date of Patent: September 19, 2017Assignee: KLA-Tencor CorporationInventors: David L. Brown, Yung-Ho Alex Chuang, John Fielden, Marcel Trimpl, Jingjing Zhang, Devis Contarato, Venkatraman Iyer
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Publication number: 20170048467Abstract: An inspection system and methods in which analog image data values (charges) captured by an image sensor are binned (combined) before or while being transmitted as output signals on the image sensor's output sensing nodes (floating diffusions), and in which an ADC is controlled to sequentially generate multiple corresponding digital image data values between each reset of the output sensing nodes. According to an output binning method, the image sensor is driven to sequentially transfer multiple charges onto the output sensing nodes between each reset, and the ADC is controlled to convert the incrementally increasing output signal after each charge is transferred onto the output sensing node. According to a multi-sampling method, multiple charges are vertically or horizontally binned (summed/combined) before being transferred onto the output sensing node, and the ADC samples each corresponding output signal multiple times. The output binning and multi-sampling methods may be combined.Type: ApplicationFiled: July 14, 2016Publication date: February 16, 2017Inventors: Yung-Ho Alex Chuang, David L. Brown, Devis Contarato, John Fielden, Daniel I. Kavaldjiev, Guoheng Zhao, Jehn-Huar Chern, Guowu Zheng, Donald W. Pettibone, Stephen Biellak
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Publication number: 20160064184Abstract: A scanning electron microscope incorporates a multi-pixel solid-state electron detector. The multi-pixel solid-state detector may detect back-scattered and/or secondary electrons. The multi-pixel solid-state detector may incorporate analog-to-digital converters and other circuits. The multi-pixel solid state detector may be capable of approximately determining the energy of incident electrons and/or may contain circuits for processing or analyzing the electron signals. The multi-pixel solid state detector is suitable for high-speed operation such as at a speed of about 100 MHz or higher. The scanning electron microscope may be used for reviewing, inspecting or measuring a sample such an unpatterned semiconductor wafer, a patterned semiconductor wafer, a reticle or a photomask. A method of reviewing or inspecting a sample is also described.Type: ApplicationFiled: August 25, 2015Publication date: March 3, 2016Inventors: David L. Brown, Yung-Ho Alex Chuang, John Fielden, Marcel Trimpl, Jingjing Zhang, Devis Contarato, Venkatraman Iyer