Patents by Inventor Dewen Xu

Dewen Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ABSORBER FOR PRINTED CIRCUIT BOARD ASSEMBLY
    Publication number: 20250107055
    Abstract: Presented herein is a printed circuit board (PCB) assembly with an absorber having a perforated structure. The absorber is positioned between a trace of a PCB and a connector that couples the PCB to an enclosure. The absorber includes a perforated structure to maintain an integrity of a signal propagated along the trace, while improving electromagnetic interference and/or electromagnetic compatibility properties.
    Type: Application
    Filed: December 20, 2023
    Publication date: March 27, 2025
    Inventors: Wenbin Ma, Shiqing He, Yong Wu, Joel Richard Goergen, Mike Sapozhnikov, Xinghai Tang, Dewen Xu, Haiying Zhu
  • Enlarged Press-Fit Hole
    Publication number: 20150173181
    Abstract: An apparatus may be provided. The apparatus may comprise a circuit board and a bore. The circuit board may have a component side surface and a bottom side surface. The bore may be disposed in the circuit board. The bore may extent from the component side surface to the bottom side surface. The bore may comprise a first portion and a second portion. The first portion may have a first diameter. The second portion may be disposed between the first portion and the component side surface. The second portion may have a second diameter greater than the first diameter.
    Type: Application
    Filed: December 16, 2013
    Publication date: June 18, 2015
    Applicant: Cisco Technology, Inc.
    Inventors: Dewen Xu, Jingping Wang, Jianqun Fu, Jiang Wang, Jing An
  • Conductive Gasket
    Publication number: 20150124425
    Abstract: An apparatus may be provided. The apparatus may comprise a core and a covering material disposed on a portion of the core. At least one opening may be disposed in the core. The at least one opening may expose at least one interior surface on the core. The at least one interior surface may be devoid of the covering material.
    Type: Application
    Filed: November 6, 2013
    Publication date: May 7, 2015
    Applicant: Cisco Technology, Inc.
    Inventors: Jing An, Luli Gong, Hua Yang, Hailong Zhang, Dewen Xu, Susan Huang, Mandy Hin Lam