Abstract: Provided is an underfill material which enables a semiconductor chip to be mounted at a low pressure, and a method for manufacturing a semiconductor device by using the underfill material. The method comprises: a semiconductor chip mounting step configured to mount a semiconductor chip having a solder bump on a substrate via an underfill film including a film forming resin having a weight average molecular weight of not more than 30000 g/mol and a molecular weight distribution of not more than 2.0, an epoxy resin, and an epoxy curing agent; and a reflow step configured to solder-bond the semiconductor chip and the substrate by a reflow furnace. The film forming resin of the underfill material has a weight average molecular weight of not more than 30000 g/mol and a molecular weight distribution of not more than 2.0, and accordingly, the viscosity at the time of heat melting can be reduced, and a semiconductor chip can be mounted at a low pressure.

Abstract: To provide an inorganic polarizing plate which, when used in structures having different used wavelength bands, can reduce reflectance by using a common structure, making it possible to achieve a predetermined light extinction ratio. The inorganic polarizing plate has a substrate that is transparent to light in a used bandwidth, a reflective layer that is composed of grids that are formed on one surface of the substrate with a pitch that is smaller than a wavelength of light in the used bandwidth, a dielectric layer that is stacked on the reflective layer, and an absorbing layer containing FeSi fine particles.

Abstract: Provided is a polarizing element in which a desired polarization characteristics are achieved and the transmissivity is also good. The polarizing element comprises: a substrate transparent to light having a bandwidth to be used; and a grid pattern made of a translucent material and configured such that a plurality of projection portions continuous in one in-plane direction of said substrate are formed on a surface of the substrate at a pitch smaller than a wavelength of light having a bandwidth to be used, wherein each of the projection portions includes a base portion with a rectangular cross-section and a tapered surface portion formed at a top of the base portion, a fine particle layer made of an inorganic material is laminated on at least one surface of said tapered surface portion, and the fine particle layer does not protrude over a side face of the base portion.