Patents by Inventor Dexter Inciong REYNOSO

Dexter Inciong REYNOSO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THEREOF
    Publication number: 20240030148
    Abstract: A semiconductor device and method is disclosed. In one example, the semiconductor device includes a single first row of leads and a first chip carrier comprising a first electrically insulating layer arranged on the single first row of leads. At least one first semiconductor chip is mounted on the first electrically insulating layer, wherein the at least one first semiconductor chip is arranged over only the single first row of leads.
    Type: Application
    Filed: July 25, 2023
    Publication date: January 25, 2024
    Applicant: Infineon Technologies AG
    Inventors: Kok Kiat KOO, So Seetharam GOBALAKRISNAN, Jürgen SCHREDL, Julian TREU, Dexter Inciong REYNOSO
  • PRE-MOLDED LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
    Publication number: 20230307328
    Abstract: One example of a pre-molded lead frame includes a mold body, a plurality of recesses, a plurality of first leads, and a die pad. The mold body includes a first main surface and a second main surface opposite to the first main surface. Each recess of the plurality of recesses extends from the first main surface into the mold body. The plurality of first leads are coupled to the mold body and extend from a third surface of the mold body. The third surface extends between the first main surface and the second main surface. The die pad is connected to at least one of the plurality of first leads. The die pad includes a first surface aligned with the second main surface of the mold body.
    Type: Application
    Filed: June 1, 2023
    Publication date: September 28, 2023
    Applicant: Infineon Technologies AG
    Inventors: Balehithlu Manjappaiah UPENDRA, Romel Solanoy LAZALA, Dexter Inciong REYNOSO, Mohamad Yazid Bin WAGIMAN
  • Pre-molded lead frames for semiconductor packages
    Patent number: 11699647
    Abstract: One example of a pre-molded lead frame includes a mold body, a plurality of recesses, and a plurality of first leads. The mold body includes a first main surface and a second main surface opposite to the first main surface. Each recess of the plurality of recesses extends from the first main surface into the mold body. The plurality of first leads are coupled to the mold body and extend from a third surface of the mold body. The third surface extends between the first main surface and the second main surface.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: July 11, 2023
    Assignee: Infineon Technologies AG
    Inventors: Balehithlu Manjappaiah Upendra, Romel Solanoy Lazala, Dexter Inciong Reynoso, Mohamad Yazid Bin Wagiman
  • PRE-MOLDED LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
    Publication number: 20220336340
    Abstract: One example of a pre-molded lead frame includes a mold body, a plurality of recesses, and a plurality of first leads. The mold body includes a first main surface and a second main surface opposite to the first main surface. Each recess of the plurality of recesses extends from the first main surface into the mold body. The plurality of first leads are coupled to the mold body and extend from a third surface of the mold body. The third surface extends between the first main surface and the second main surface.
    Type: Application
    Filed: April 15, 2021
    Publication date: October 20, 2022
    Applicant: Infineon Technologies AG
    Inventors: Balehithlu Manjappaiah UPENDRA, Romel Solanoy LAZALA, Dexter Inciong REYNOSO, Mohamad Yazid Bin WAGIMAN