Abstract: The embodiments of the present invention provide a packaging structure for OLED device, packaging method and electronic equipment. According to the embodiments of the invention, an anaerobic sealant is applied in the OLED packaging process as a packaging material. Since anaerobic sealant can be cured at room temperature without heat curing or UV curing, the technological process can be simplified, saving the cost. Meanwhile, the OLED process per se should be performed in a vacuum or inert gas environment (i.e., an anaerobic environment), which is advantageous for applying the anaerobic sealant; therefore no more investment is required, and the cost is saved. Moreover, the bonding strength of the cured anaerobic sealant is relatively strong, thus the sealed bonding between the cover plate and the substrate can be realized without an additional dam coating process, simplifying the technological process.