Abstract: The disclosure relates to the technical field of batteries, and provides a battery manufacturing method, a battery, a battery module, and a battery pack. The battery manufacturing method includes following steps. Providing an insulating mylar, laminating on the insulating mylar to form a laminated cell that includes a separator film different from the insulating mylar, and wrapping the laminated cell with the insulating mylar. By laminating on the insulating mylar to form the laminated cell and then wrapping the laminated cell with the insulating mylar, a process of moving the laminated cell to the insulating mylar is omitted.

Abstract: The disclosure relates to the technical field of batteries, and provides a battery manufacturing method and a battery. The battery manufacturing method includes the following steps. Providing a first casing that includes one of an upper cover and a bottom plate of a battery casing, and laminating on the first casing to form a laminated cell.

Abstract: A surface treatment method for solder joint employs alkali buffer solution dipping the solder joint and the alkali buffer solution reacts with the solder joint thus yielding a passive layer. As the resultant passive layer forms on the surface of the solder joint, thereby prevents further corrosion and dissolution during aqueous cleaning or water dipping thereafter. In addition, the passive layer ensures a good appearance with maximum protection of the solder joint and also provides a sound reliability and a high testability of a finished electronic product equipped with the solder joint.

Abstract: A surface treatment method for solder joint employs alkali buffer solution dipping the solder joint and the alkali buffer solution reacts with the solder joint thus yielding a passive layer. As the resultant passive layer forms on the surface of the solder joint, thereby prevents further corrosion and dissolution during aqueous cleaning or water dipping thereafter. In addition, the passive layer ensures a good appearance with maximum protection of the solder joint and also provides a sound reliability and a high testability of a finished electronic product equipped with the solder joint.