Patents by Inventor De-Yu Wang

De-Yu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240089666
    Abstract: A double-sided loudspeaker includes a first speaker base and a second speaker base assembled with each other and provided with a ventilation hole; a first side magnetic plate injection molded at the first speaker base or the second speaker base; a second side magnetic plate injection molded at the first speaker base or the second speaker base; a magnetic member disposed between the first side magnetic plate and the second side magnetic plate and including a main magnetic plate, a first magnetic unit and a second magnetic unit; a first diaphragm disposed at the first speaker base; a first voice coil disposed at the first diaphragm and movably arranged at the first magnetic unit; a second diaphragm disposed at the second speaker base; and a second voice coil disposed at the second diaphragm and movably arranged at the second magnetic unit.
    Type: Application
    Filed: December 13, 2022
    Publication date: March 14, 2024
    Inventors: PING-YU LEE, DE-WU WANG, ZHI-LONG NIU, YU-HSI CHEN
  • Publication number: 20220280724
    Abstract: An injection device includes a case body, a control circuit disposed on the outside of the case body, a movable part disposed in the case body, carrying a drug, and movable between a start position and a target position, a magnetic member movable along with the movable part and producing a magnetic field, and a magnetic switch disposed on the outside of the case body and connected to the control circuit. When the movable part is moved to the target position, the magnetic switch changes a status of a conductive path of the magnetic switch in response to a presence of the magnetic field. The control circuit changes a state of the injection device according to a change of the status of the conductive path.
    Type: Application
    Filed: March 3, 2022
    Publication date: September 8, 2022
    Applicant: Jabil Circuit (Shanghai) Co., Ltd.
    Inventor: De Yu Wang
  • Patent number: 8659892
    Abstract: An exemplary electronic device includes a base, a cover, side plates, a heat conduct plate, a wick structure, a working medium and at least one electronic element. The cover and the base cooperatively define a cavity. The at least one side plate extends from the cover and receives in the cavity. The heat conduct plate and the at least side plate and the cover cooperatively defines a sealed chamber. The wick structure is attached to an inner surface of the sealed chamber. The working medium is received in the wick structure. The at least one electronic element is received in the cavity and thermally connected to the heat conduct plate.
    Type: Grant
    Filed: August 8, 2011
    Date of Patent: February 25, 2014
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Qing-Ping Yan, De-Yu Wang, Jiang-Jun Hu, Chuen-Shu Hou
  • Patent number: 8622118
    Abstract: An exemplary loop heat pipe includes an evaporator, a condenser, a vapor line and a liquid line each connecting the evaporator with the condenser to form a closed loop. A working medium is contained in the closed loop. A wick structure is received in the evaporator, and includes a bottom wall contacting the bottom plate, a support wall extending up from the bottom wall and contacting the cover plate, and guide walls extending out laterally from the support wall. The support wall separates an interior of the evaporator into a liquid chamber adjacent to the liquid line and a vapor chamber adjacent to the vapor line. The guide walls are located in the vapor chamber. Guide channels are defined between the guide walls for guiding the working medium in a vapor state to flow from the vapor chamber through the vapor line to the condenser.
    Type: Grant
    Filed: October 31, 2010
    Date of Patent: January 7, 2014
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: De-Yu Wang, Chao Xu, Jiang-Jun Hu
  • Publication number: 20120307452
    Abstract: An exemplary portable electronic device includes a printed circuit board, a heat generating electronic component mounted on the printed circuit board, a shell housing the printed circuit board, the heat generating electronic component and a heat pipe therein. The heat pipe includes an evaporating side and a condensing side. The evaporating side thermally contacts the heat generating electronic component, and the condensing side thermally contacts the shell.
    Type: Application
    Filed: September 20, 2011
    Publication date: December 6, 2012
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: QING-PING YAN, DE-YU WANG, JIANG-JUN HU, CHUEN-SHU HOU
  • Publication number: 20120307453
    Abstract: An exemplary electronic device includes a base, a cover, side plates, a heat conduct plate, a wick structure, a working medium and at least one electronic element. The cover and the base cooperatively define a cavity. The at least one side plate extends from the cover and receives in the cavity. The heat conduct plate and the at least side plate and the cover cooperatively defines a sealed chamber. The wick structure is attached to an inner surface of the sealed chamber. The working medium is received in the wick structure. The at least one electronic element is received in the cavity and thermally connected to the heat conduct plate.
    Type: Application
    Filed: August 8, 2011
    Publication date: December 6, 2012
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: QING-PING YAN, DE-YU WANG, JIANG-JUN HU, CHUEN-SHU HOU
  • Patent number: 8316921
    Abstract: A heat sink includes a fin assembly including a plurality of fins and a plate type heat pipe attached to the fin assembly. The plate type heat pipe includes a sealed shell in which a working fluid is filled, a wick layer formed on an inner face of the shell and a supporting member disposed in the shell. The supporting member includes a plurality of supporting portions and a plurality of bodies connecting the supporting portions. Each supporting portion includes a plurality of convex portions contacting a top of the wick layer and a plurality of concave portions contacting a bottom of the wick layer. The convex portions and the concave portions of each supporting portion are alternately arranged. Each convex portion and an adjacent concave portion cooperatively enclose a first through hole for the working fluid flowing therethrough.
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: November 27, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chuen-Shu Hou, Jiang-Jun Hu, Min Lu, De-Yu Wang
  • Publication number: 20120241133
    Abstract: A vapor chamber includes a heat absorbing plate and a heat dissipating plate attached to the heat absorbing plate. The heat absorbing plate includes a wick structure thereon facing the heat dissipating plate. The wick structure defines a plurality of first grooves and a plurality of second grooves intersecting the first grooves. The heat dissipating plate forms a hermetically sealed container in cooperation with the heat absorbing plate. The hermetically sealed container receives the wick structure therein. Working fluid is sealed inside the container and flows in the first grooves and the second grooves.
    Type: Application
    Filed: June 29, 2011
    Publication date: September 27, 2012
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: QING-PING YAN, DE-YU WANG, JIANG-JUN HU
  • Publication number: 20120160812
    Abstract: An exemplary method for sealing a vapor chamber includes, firstly, providing a casing, wherein the casing has an opening. Then a metallic tube is inserted into the opening such that the tube is hermetically engaged in the opening. Next, a pressing mold is provided, wherein the pressing mold includes a positive pole and a negative pole opposite to the positive pole. A free end of the tube is pressed by the positive pole and the negative pole of the pressing mold to form a crimped sealing portion. Then electricity is charged between the positive pole and the negative pole. The electricity passes through the crimped sealing portion and heats an inner face of the crimped sealing portion to weld the crimped sealing portion.
    Type: Application
    Filed: July 25, 2011
    Publication date: June 28, 2012
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: DE-YU WANG, JIANG-JUN HU, QING-PING YAN
  • Publication number: 20120111541
    Abstract: A plate-type heat pipe includes a sealed shell containing working liquid therein, and elongated wick structures arranged in the shell in a spaced manner. Channels are formed between the wick structures. The heat pipe has an evaporating section and a condensing section. Two ends of each wick structure are respectively located at the evaporating section and the condensing section. Top and bottom faces of each wick structure respectively contact top and bottom inner faces of the shell.
    Type: Application
    Filed: December 23, 2010
    Publication date: May 10, 2012
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: QING-PING YAN, DE-YU WANG, JIANG-JUN HU
  • Publication number: 20120043060
    Abstract: An exemplary loop heat pipe includes an evaporator, a condenser, a vapor line and a liquid line each connecting the evaporator with the condenser to form a closed loop. A working medium is contained in the closed loop. A wick structure is received in the evaporator, and includes a bottom wall contacting the bottom plate, a support wall extending up from the bottom wall and contacting the cover plate, and guide walls extending out laterally from the support wall. The support wall separates an interior of the evaporator into a liquid chamber adjacent to the liquid line and a vapor chamber adjacent to the vapor line. The guide walls are located in the vapor chamber. Guide channels are defined between the guide walls for guiding the working medium in a vapor state to flow from the vapor chamber through the vapor line to the condenser.
    Type: Application
    Filed: October 31, 2010
    Publication date: February 23, 2012
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: DE-YU WANG, CHAO XU, JIANG-JUN HU
  • Publication number: 20120043059
    Abstract: A loop heat pipe includes an evaporator, a condenser, and a vapor line and a liquid line each connecting the evaporator with the condenser to form a closed loop. A predetermined quantity of bi-phase working medium is contained in the closed loop. A separator connects the liquid line. A cross section of the separator is larger than a cross section of the liquid line. The separator separates the liquid state working medium from the vapor state working medium when the working medium flows therethrough.
    Type: Application
    Filed: October 25, 2010
    Publication date: February 23, 2012
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: CHAO XU, JIANG-JUN HU, DE-YU WANG, CHUEN-SHU HOU
  • Publication number: 20110240264
    Abstract: An exemplary plate-type heat pipe includes a condensing plate, an evaporating plate and a spherical supporting. The evaporating plate engages with the condensing plate to define a hermetic container. Working fluid is contained in the container. The supporting portion in the container is sandwiched between the condensing plate and the evaporating plate and abuts against the condensing plate and the evaporating plate.
    Type: Application
    Filed: April 30, 2010
    Publication date: October 6, 2011
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: DE-YU WANG, JIANG-JUN HU
  • Publication number: 20110232874
    Abstract: A heat dissipation apparatus includes an evaporator receiving heat from a heat source, a condenser releasing the heat of the heat source, and a pipeline inter connecting the evaporator and the condenser. The condenser defines a flat rectangular chamber therein. A working fluid is contained in the evaporator. The working fluid vaporizes upon receiving the heat of the heat source. The pipeline conducts the vaporized working fluid from the evaporator to the condenser. The vaporized working fluid condenses upon releasing the heat in the chamber.
    Type: Application
    Filed: April 30, 2010
    Publication date: September 29, 2011
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHAO XU, DE-YU WANG, JIANG-JUN HU
  • Publication number: 20110005725
    Abstract: A heat sink includes a fin assembly including a plurality of fins and a plate type heat pipe attached to the fin assembly. The plate type heat pipe includes a sealed shell in which a working fluid is filled, a wick layer formed on an inner face of the shell and a supporting member disposed in the shell. The supporting member includes a plurality of supporting portions and a plurality of bodies connecting the supporting portions. Each supporting portion includes a plurality of convex portions contacting a top of the wick layer and a plurality of concave portions contacting a bottom of the wick layer. The convex portions and the concave portions of each supporting portion are alternately arranged. Each convex portion and an adjacent concave portion cooperatively enclose a first through hole for the working fluid flowing therethrough.
    Type: Application
    Filed: September 4, 2009
    Publication date: January 13, 2011
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUEN-SHU HOU, JIANG-JUN HU, MIN LU, DE-YU WANG
  • Publication number: 20100326630
    Abstract: A method for manufacturing a heat spreader includes steps of: providing an elongated and flat sectional material with a through hole defined therein; cutting the sectional material into a plurality of parts each in a predetermined length to form a plurality of casings, wherein each of the casings defines a vapor chamber therein and has at least an opening in a side thereof; forming a wick structure on an inner face of the casing; providing a plurality of supporting members; placing and fixing the supporting members into the vapor chamber of the casing; and injecting working liquid into the vapor chamber and sealing the casing.
    Type: Application
    Filed: September 9, 2009
    Publication date: December 30, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventor: De-Yu Wang
  • Publication number: 20100319881
    Abstract: The heat spreader includes a flattened casing which defines a vapor chamber therein, a wick structure formed on an inner face of the casing and a supporting frame received in the vapor chamber. The supporting frame includes a plurality of supporting wires. Each of the supporting wires has a column-spiral configuration.
    Type: Application
    Filed: August 14, 2009
    Publication date: December 23, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventor: DE-YU WANG
  • Patent number: 6052658
    Abstract: The present invention provides a sinusoidal transform vocoder based on the Bark spectrum, which has high quality and low bit rate for coding. The present invention includes the steps of transforming a harmonic sine wave from a frequency spectrum to a perception-based Bark spectrum. An equal-loudness pre-emphasis and the loudness to a subjective loudness transformation are also involved in the method. Last, a pulse code modulation (PCM) is used to quantize the subjective loudness to obtain quantized subjective loudness. In synthesis, the Bark spectrum is inversely processed to obtain the excitation pattern following the sone-to-phone conversion and equal-loudness deemphasis. Then, the sine wave amplitudes can be estimated from the excitation pattern by assuming that the amplitudes belonging to the same critical band are equal.
    Type: Grant
    Filed: June 10, 1998
    Date of Patent: April 18, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: De-Yu Wang, Wen-Whei Chang, Hwai-Tsu Chang, Huang-Lin Yang