Patents by Inventor Dhammika L. Perera

Dhammika L. Perera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • APPARATUS FOR AN INDUCTOR DISPOSED IN A BAND FOR METHOD OF HEAT DISPERSION
    Publication number: 20240023291
    Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.
    Type: Application
    Filed: August 31, 2023
    Publication date: January 18, 2024
    Inventors: Dhammika L. Perera, John Weld, Matthew Wilkowski
  • Apparatus for an inductor disposed in a band for method of heat dispersion
    Patent number: 11770916
    Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: September 26, 2023
    Assignee: Modular Power Technoogy, Inc.
    Inventors: Dhammika L. Perera, John Weld, Matthew Wilkowski
  • APPARATUS FOR AN INDUCTOR DISPOSED IN A BAND FOR METHOD OF HEAT DISPERSION
    Publication number: 20220272864
    Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.
    Type: Application
    Filed: March 4, 2022
    Publication date: August 25, 2022
    Inventors: Dhammika L. Perera, John Weld, Matthew Wilkowski
  • APPARATUS FOR A DC-DC CONVERTER INDUCTOR
    Publication number: 20220130589
    Abstract: An apparatus includes at least one top magnetic core comprising a first material with a first resistivity. The apparatus further includes at least one bottom magnetic core coupled to the at least one top magnetic core, the at least one bottom magnetic core comprising a second material with a second resistivity and at least one internal conductor coupled to the at least one top magnetic core and the at least one bottom magnetic core.
    Type: Application
    Filed: October 6, 2021
    Publication date: April 28, 2022
    Inventors: Dhammika L. Perera, John Weld, Matthew Wilkowski
  • APPARATUS FOR AN INDUCTOR DISPOSED IN A BAND FOR METHOD OF HEAT DISPERSION
    Publication number: 20220132696
    Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.
    Type: Application
    Filed: October 6, 2021
    Publication date: April 28, 2022
    Inventors: Dhammika L. Perera, John Weld, Matthew Wilkowski
  • APPARATUS FOR POWER MODULE AND HEAT DISSIPATION OF AN INTEGRATED CIRCUIT
    Publication number: 20220132695
    Abstract: Embodiments of the present disclose a power module system including a power module operatively coupled to an integrated circuit die, where the power module includes a band comprising of a high thermally conductive material disposed around an inductor and where the band is at least partially disposed around the inductor
    Type: Application
    Filed: October 6, 2021
    Publication date: April 28, 2022
    Inventors: Dhammika L. Perera, John Weld, Matthew Wilkowski
  • Apparatus for an inductor disposed in a band for method of heat dispersion
    Patent number: 11317545
    Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: April 26, 2022
    Assignee: MODULAR POWER TECHNOLOGY, INC.
    Inventors: Dhammika L. Perera, John Weld, Matthew Wilkowski