Abstract: Systems, methods, and devices can include a processing engine implemented at least partially in hardware, the processing engine to process memory transactions; a memory element to index physical address and virtual address translations; and a memory controller logic implemented at least partially in hardware, the memory controller logic to receive an index from the processing engine, the index corresponding to a physical address and a virtual address; identify a physical address based on the received index; and provide the physical address to the processing engine. The processing engine can use the physical address for memory transactions in response to a streaming workload job request.

Abstract: A foldable electronic device module includes: a glass-containing cover element having a thickness from about (25) ?m to about (200) ?m, an elastic modulus from about (20) to (140) GPa, and first and second primary surfaces; a stack comprising: (a) an interlayer having an elastic modulus from about (0.01) to (10) GPa and a thickness from about 50 to (200) ?m, and (b) a flexible substrate having a thickness from about (100) to (200) ?m; and a first adhesive joining the stack to the cover element, and comprising an elastic modulus from about (0.001) to (10) GPa and a thickness from about (5) to (25) ?m. Further, the module comprises an impact resistance characterized by tensile stresses of less than about (4100) MPa and less than about (8300) MPa at the first and second primary surfaces of the cover element, respectively, upon an impact in a Pen Drop Test.

Abstract: A laminated glass article including a base layer, an anisotropic layer disposed over a top surface of the base layer, and a glass layer disposed over the anisotropic layer. The anisotropic layer may include homogeneous mechanical anisotropic properties measured at intervals of 250 microns. In some embodiments, the anisotropic layer may be an orthotropic layer including homogeneous mechanical orthotropic properties measured at intervals of 250 microns. The homogenous mechanical anisotropic or orthotropic properties of the anisotropic layer may provide a flexible laminated glass article with a high resistance to impact and puncture forces. In some embodiments, the laminated glass article may define all or a portion of a cover substrate for a consumer product.

Abstract: A foldable electronic device module includes a glass cover element having a thickness from about 25 ?m to about 200 ?m, an elastic modulus from about 20 GPa to about 140 GPa and a puncture resistance of at least 1.5 kgf. The module further includes a stack with a thickness between about 100 ?m and about 600 ?m; and a first adhesive joining the stack to the cover element with a shear modulus between about 1 MPa and about 1 GPa. The stack further includes a panel, an electronic device, and a stack element affixed to the panel with a stack adhesive. Further, the device module is characterized by a tangential stress at a primary surface of the cover element of no greater than about 1000 MPa in tension upon bending the module to a radius from about 20 mm to about 2 mm.

Abstract: A glass-ceramic article having one or more crystalline phases; a residual glass phase; a compressive stress layer extending from a first surface to a depth of compression (DOC); a maximum central tension greater than 70 MPa; a stored tensile energy greater than 22 J/m2; a fracture toughness greater than 1.0 MPa?m; and a haze less than 0.2.

Abstract: A glass ceramic article including a lithium disilicate crystalline phase, a petalite crystalline phased, and a residual glass phase. The glass ceramic article has a warp (?m)<(3.65×10?6/?m×diagonal2) where diagonal is a diagonal measurement of the glass ceramic article in ?m, a stress of less than 30 nm of retardation per mm of glass ceramic article thickness, a haze (%)<0.0994t+0.12 where t is the thickness of the glass ceramic article in mm, and an optical transmission (%)>0.91×10(2-0.03t) of electromagnetic radiation wavelengths from 450 nm to 800 nm, where t is the thickness of the glass ceramic article in mm.

Abstract: Systems, methods, and devices can include a processing engine implemented at least partially in hardware, the processing engine to process memory transactions; a memory element to index physical address and virtual address translations; and a memory controller logic implemented at least partially in hardware, the memory controller logic to receive an index from the processing engine, the index corresponding to a physical address and a virtual address; identify a physical address based on the received index; and provide the physical address to the processing engine. The processing engine can use the physical address for memory transactions in response to a streaming workload job request.

Abstract: A foldable electronic device module that includes a glass cover element having a thickness from about 25 ?m to about 200 ?m, an elastic modulus from about 20 GPa to about 140 GPa. The module further includes: a stack having a thickness from about 50 ?m to about 600 ?m; and a first adhesive joining the stack to a second primary surface of the cover element, the adhesive having a shear modulus from about 0.01 MPa to about 1 GPa and a glass transition temperature of at least 80 C. Further, the device module includes a flex-bond residual stress region through the thickness, and within a central region, of the cover element that ranges from a maximum compressive residual stress at the second primary surface to a maximum tensile residual stress at a first primary surface of the element along a central bend axis of the cover element.

Abstract: A foldable electronic device module includes a glass cover element having a thickness from about 25 ?m to about 200 ?m, an elastic modulus from about 20 GPa to about 140 GPa and a puncture resistance of at least 1.5 kgf. The module further includes a stack with a thickness between about 100 ?m and about 600 ?m; and a first adhesive joining the stack to the cover element with a shear modulus between about 1 MPa and about 1 GPa. The stack further includes a panel, an electronic device, and a stack element affixed to the panel with a stack adhesive. Further, the device module is characterized by a tangential stress at a primary surface of the cover element of no greater than about 1000 MPa in tension upon bending the module to a radius from about 20 mm to about 2 mm.

Abstract: A foldable electronic device module includes a glass cover element having a thickness from about 25 ?m to about 200 ?m, an elastic modulus from about 20 GPa to about 140 GPa and a puncture resistance of at least 1.5 kgf. The module further includes a stack with a thickness between about 100 ?m and about 600 ?m; and a first adhesive joining the stack to the cover element with a shear modulus between about 1 MPa and about 1 GPa. The stack further includes a panel, an electronic device, and a stack element affixed to the panel with a stack adhesive. Further, the device module is characterized by a tangential stress at a primary surface of the cover element of no greater than about 1000 MPa in tension upon bending the module to a radius from about 20 mm to about 2 mm.

Abstract: Systems and methods for modifying a medical model of a physical system is disclosed. One disclosed system includes a graphical user interface configured to display at least one parameter associated with the medical model and receive a modification of the at least one parameter. The system also includes a processor configured to receive the modification of the at least one parameter from the graphical user interface and execute a simulation of a part of the medical model including the modification of the at least one parameter.

Abstract: A method for optimizing machining parameters for a cutting process performed on a work piece. Finite element analysis of cutting tool and work material interaction is initially performed. Mechanistic modeling of the cutting process, using results of the finite element analysis, is then performed to provide optimized machining parameters for improved rate of material removal and tool life. Optionally, a two-stage artificial neural network may be supplementally employed, wherein a first stage of the network provides output parameters including peak tool temperature and cutting forces in X and Y directions, for a combination of input reference parameters including tool rake angle, material cutting speed, and feed rate.

Abstract: A bridge includes a memory to establish a transaction table and write combining windows. Each write combining window is associated with a cache line and is subdivided into subwindows; and each of the subwindows is associated with a partial cache line. The bridge includes a controller to determine whether an incoming partial write transaction conflicts with a transaction stored in the transaction table. If a conflict occurs, the controller uses the write combining windows to combine the partial write transaction with another partial write transaction if one of the partial write combining windows is available. The controller issues a retry signal to a processor originating the partial write transaction if none of the partial write combining windows are available.

Abstract: Systems and methods for modifying a medical model of a physical system is disclosed. One disclosed system includes a graphical user interface configured to display at least one parameter associated with the medical model and receive a modification of the at least one parameter. The system also includes a processor configured to receive the modification of the at least one parameter from the graphical user interface and execute a simulation of a part of the medical model including the modification of the at least one parameter.

Abstract: A method and apparatus for reducing the number of base stations used for paging a mobile station by obtaining a higher location precision of the mobile station by providing a first location update at a first location register from a wireless communication device (515, 520); sending a second location update to a second location register in response to the first location update (525, 530); and determining the location of the wireless communication device based on at least one of the first location register and the second location register (535), wherein the first location register corresponds to a first location area and the second location register corresponds to a second location area. The invention proposes to include a universal location area server (305) to perform a correlation between the first location register and a second location register to obtain the reduced set of base stations.