Abstract: In an embodiment a method for assembling NTC sensor includes providing an NTC thermistor element and connection wires having terminals for contacting the NTC thermistor element; and self-heating the NTC thermistor element while applying an electrical current during the following steps: dispensing solder paste to the terminals of the connection wires, applying the connection wires to the NTC thermistor element and melting the solder paste by a generated heat of the NTC thermistor element thereby forming solder bonds between the NTC thermistor element and the connection wires.

Abstract: In an embodiment a NTC sensor include a chip, two parallel wires, each wire having contact points, and contact-connections between the chip and the contact points of each of the wires, wherein a maximum lateral dimension of the NTC sensor in any direction perpendicular to a direction of extension of the wires is equal to or less than a sum of the lateral dimensions of the chip and the wires.