Patents by Inventor Dhananjay Joshi
Dhananjay Joshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20260198101Abstract: Various embodiments of a solar module and related methods are disclosed herein, including at least one solar cell having a functional material positioned in electrical communication with an electrical wiring component, a first substrate configured of a transparent material; a second substrate, configured in spaced relation from the first substrate, such that the functional material is configured between the first substrate and the second material and an encapsulant (at least one) retained in place via an encapsulant configured between the first substrate and the solar cell and the second substate and the solar cell, further configured to retain the solar cell in place between the first substrate and the second substrate; wherein at least one of the first substrate and the second substrate is a glass material.Type: ApplicationFiled: November 29, 2023Publication date: July 9, 2026Inventors: Oladapo Olalekan Bello, Kurt Edward Gerber, Lisa Lynn Griesbach Hawkins, Eric Scott Hamby, Dhananjay Joshi, James Ernest Webb
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Patent number: 12655057Abstract: A glass-ceramic article having one or more crystalline phases; a residual glass phase; a compressive stress layer extending from a first surface to a depth of compression (DOC); a maximum central tension greater than 70 MPa; a stored tensile energy greater than 22 J/m2; a fracture toughness greater than 1.0 MPa?m; and a haze less than 0.2.Type: GrantFiled: September 26, 2025Date of Patent: June 16, 2026Assignee: CORNING INCORPORATEDInventors: Carol Ann Click, Indrajit Dutta, James Howard Edmonston, Michael S Fischer, Qiang Fu, Ozgur Gulbiten, Jill Marie Hall, Mathieu Gerard Jacques Hubert, Dhananjay Joshi, Andrew Peter Kittleson, Rohit Rai, John Robert Saltzer, Jr., Charlene Marie Smith, Matthew Daniel Trosa, Matthew Artus Tuggle, James Clark Walck, Jr., Alana Marie Whittier, Zheming Zheng
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Patent number: 12632290Abstract: Apparatus and method for managing pipeline depth of a data processing device. For example, one embodiment of an accelerator comprises: an interface to receive a plurality of work requests from a plurality of clients; and a plurality of engines to perform the plurality of work requests; wherein the work requests are to be dispatched to the plurality of engines from work queues, the work queues to store a work descriptor per work request, each work descriptor to include information needed to perform a corresponding work request, wherein the work queues include a first and a second work queue to store work descriptors associated with first latency characteristics and second latency characteristics, respectively; engine configuration circuitry to configure a first engine to have a first pipeline depth based on the first latency characteristics and to configure a second engine to have a second pipeline depth based on the second latency characteristics.Type: GrantFiled: December 22, 2021Date of Patent: May 19, 2026Assignee: Intel CorporationInventors: Saurabh Gayen, Dhananjay Joshi, Philip Lantz, Rajesh Sankaran, Narayan Ranganathan
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Patent number: 12623957Abstract: A glass-ceramic article having one or more crystalline phases; a residual glass phase; a compressive stress layer extending from a first surface to a depth of compression (DOC); a maximum central tension greater than 70 MPa; a stored tensile energy greater than 22 J/m2; a fracture toughness greater than 1.0 MPa?m; and a haze less than 0.2.Type: GrantFiled: July 16, 2019Date of Patent: May 12, 2026Assignee: CORNING INCORPORATEDInventors: Carol Ann Click, Indrajit Dutta, James Howard Edmonston, Michael S Fischer, Qiang Fu, Ozgur Gulbiten, Jill Marie Hall, Mathieu Gerard Jacques Hubert, Dhananjay Joshi, Andrew Peter Kittleson, Rohit Rai, John Robert Saltzer, Jr., Charlene Marie Smith, Matthew Daniel Trosa, Matthew Artus Tuggle, James Clark Walck, Jr., Alana Marie Whittier, Zheming Zheng
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METHOD AND APPARATUS FOR HIGH-PERFORMANCE PAGE-FAULT HANDLING FOR MULTI-TENANT SCALABLE ACCELERATORS
Publication number: 20260056828Abstract: Apparatus and method for high-performance page fault handling. For example, one embodiment of an apparatus comprises: one or more accelerator engines to process work descriptors submitted by clients to a plurality of work queues; fault processing hardware logic associated with the one or more accelerator engines, the fault processing hardware logic to implement a specified page fault handling mode for each work queue of the plurality of work queues, the page fault handling modes including a first page fault handling mode and a second page fault handling mode.Type: ApplicationFiled: October 6, 2025Publication date: February 26, 2026Inventors: Utkarsh Y. KAKAIYA, Philip LANTZ, Sanjay KUMAR, Rajesh SANKARAN, Narayan RANGANATHAN, Saurabh GAYEN, Dhananjay JOSHI, Nikhil P. RAO -
Publication number: 20260056576Abstract: Foldable apparatus comprise a foldable substrate foldable about an axis and a substrate thickness defined between a first major surface and a second major surface. The foldable substrate comprises a central portion positioned between a first portion and a second portion. The first portion comprising a substrate thickness. The central portion comprises a central thickness that is less than the substrate thickness. In some embodiments, a width of central portion is about 45 millimeters or less. Methods of making a foldable apparatus comprise forming a recess in a first major surface of the foldable substrate. In some embodiments, methods comprise chemically strengthening the foldable substrate.Type: ApplicationFiled: October 30, 2025Publication date: February 26, 2026Inventors: Shinu Baby, Naigeng Chen, Timothy Michael Gross, Jason Thomas Harris, Dhananjay Joshi, Yousef Kayed Qaroush, Arlin Lee Weikel, Tingge Xu
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Publication number: 20260022057Abstract: A glass-ceramic article having one or more crystalline phases; a residual glass phase; a compressive stress layer extending from a first surface to a depth of compression (DOC); a maximum central tension greater than 70 MPa; a stored tensile energy greater than 22 J/m2; a fracture toughness greater than 1.0 MPa?m; and a haze less than 0.2.Type: ApplicationFiled: September 26, 2025Publication date: January 22, 2026Inventors: Carol Ann Click, Indrajit Dutta, James Howard Edmonston, Michael S Fischer, Qiang Fu, Ozgur Gulbiten, Jill Marie Hall, Mathieu Gerard Jacques Hubert, Dhananjay Joshi, Andrew Peter Kittleson, Rohit Rai, John Robert Saltzer, JR., Charlene Marie Smith, Matthew Daniel Trosa, Matthew Artus Tuggle, James Clark Walck, JR., Alana Marie Whittier, Zheming Zheng
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Publication number: 20250393147Abstract: Foldable apparatus can comprise a foldable substrate comprising a substrate thickness and a central portion positioned between a first portion and a second portion. The central portion can comprise a central thickness less than the substrate thickness. A first maximum tensile stress of a first tensile stress region in the first portion and a second maximum tensile stress of the second tensile stress region in the second portion can be less than a third maximum tensile stress of a central tensile stress region in the central portion. Ribbons can comprise a ribbon thickness and a central portion positioned between a first portion and a second portion. The central portion can comprise a first central compressive stress region and a second central compressive stress region. In some embodiments, methods of processing a ribbon can comprise masking the first portion, masking the second portion, and chemically strengthening the central portion.Type: ApplicationFiled: August 25, 2025Publication date: December 25, 2025Inventors: Naigeng Chen, Matthew Wade Fenton, Timothy Michael Gross, Yuhui Jin, Dhananjay Joshi, Kuan-Ting Kuo, Yousef Kayed Qaroush
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Patent number: 12481316Abstract: Foldable apparatus comprise a foldable substrate foldable about an axis and a substrate thickness defined between a first major surface and a second major surface. The foldable substrate comprises a central portion positioned between a first portion and a second portion. The first portion comprising a substrate thickness. The central portion comprises a central thickness that is less than the substrate thickness. In some embodiments, a width of central portion is about 45 millimeters or less. Methods of making a foldable apparatus comprise forming a recess in a first major surface of the foldable substrate. In some embodiments, methods comprise chemically strengthening the foldable substrate.Type: GrantFiled: August 28, 2020Date of Patent: November 25, 2025Assignee: CORNING INCORPORATEDInventors: Shinu Baby, Naigeng Chen, Timothy Michael Gross, Jason Thomas Harris, Dhananjay Joshi, Yousef Kayed Qaroush, Arlin Lee Weikel, Tingge Xu
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Method and apparatus for high-performance page-fault handling for multi-tenant scalable accelerators
Patent number: 12443477Abstract: Apparatus and method for high-performance page fault handling. For example, one embodiment of an apparatus comprises: one or more accelerator engines to process work descriptors submitted by clients to a plurality of work queues; fault processing hardware logic associated with the one or more accelerator engines, the fault processing hardware logic to implement a specified page fault handling mode for each work queue of the plurality of work queues, the page fault handling modes including a first page fault handling mode and a second page fault handling mode.Type: GrantFiled: December 22, 2021Date of Patent: October 14, 2025Assignee: Intel CorporationInventors: Utkarsh Y. Kakaiya, Philip Lantz, Sanjay Kumar, Rajesh Sankaran, Narayan Ranganathan, Saurabh Gayen, Dhananjay Joshi, Nikhil P. Rao -
Patent number: 12426184Abstract: Foldable apparatus can comprise a foldable substrate comprising a substrate thickness and a central portion positioned between a first portion and a second portion. The central portion can comprise a central thickness less than the substrate thickness. A first maximum tensile stress of a first tensile stress region in the first portion and a second maximum tensile stress of the second tensile stress region in the second portion can be less than a third maximum tensile stress of a central tensile stress region in the central portion. Ribbons can comprise a ribbon thickness and a central portion positioned between a first portion and a second portion. The central portion can comprise a first central compressive stress region and a second central compressive stress region. In some embodiments, methods of processing a ribbon can comprise masking the first portion, masking the second portion, and chemically strengthening the central portion.Type: GrantFiled: August 28, 2020Date of Patent: September 23, 2025Assignee: CORNING INCORPORATEDInventors: Naigeng Chen, Matthew Wade Fenton, Timothy Michael Gross, Yuhui Jin, Dhananjay Joshi, Kuan-Ting Kuo, Yousef Kayed Qaroush
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Patent number: 12241007Abstract: Articles including a substrate, a cover glass layer disposed over a top surface of the substrate, and an adhesive layer having a dynamic elastic modulus disposed between a bottom surface of the cover glass layer and the top surface of the substrate. The cover glass layer may have a thickness in the range of 1 micron to 200 microns. The dynamic elastic modulus of the adhesive layer may include a first elastic modulus in the range of 10 kPa to 1000 kPa measured at a stress frequency in the range of 0 Hertz to 5 Hertz and a temperature of 23 degrees C., and a second elastic modulus of 500 MPa or more measured at a stress frequency in the range of 10 Hertz to 1000 Hertz and a temperature of 23 degrees C. The adhesive layer may be optically transparent. The articles may be bendable electronic display devices or bendable electronic display device modules.Type: GrantFiled: August 12, 2020Date of Patent: March 4, 2025Assignee: CORNING INCORPORATEDInventors: Shinu Baby, Naigeng Chen, Edward John Fewkes, Dhananjay Joshi, Andrew Peter Kittleson, Yousef Kayed Qaroush, Ying Zhang
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Publication number: 20250035140Abstract: Disclosed is a coupler for engaging C shaped stakes of a signpost. The coupler comprises an inner hollow rectangular shaft member and an outer hollow rectangular shaft member. Specifically, the outer hollow rectangular shaft member surrounds the inner hollow rectangular shaft member. The coupler further comprises a plurality of veins configured to run vertically on inner surface of the outer hollow rectangular shaft member and outer surface of the inner hollow rectangular shaft member and a support member configured within the gap of the inner hollow rectangular shaft member and the outer hollow rectangular shaft member at midportion to support C shaped stake thereon and to stop another C shaped member to move upward from lower side.Type: ApplicationFiled: January 26, 2024Publication date: January 30, 2025Applicant: Indian Metal SolutionsInventors: Dhananjay Joshi, Sachin Barve
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Patent number: 12207405Abstract: A substrate including a via with a beveled overburden is disclosed. The substrate can include a substrate having a first surface, a second surface opposite the first surface, and a via passing from the first surface to the second surface. The via can be coated with a metallic layer that includes a first beveled overburden on the first surface, and the first beveled overburden can include a first outer edge that forms a first bevel angle greater than 95° with the first surface. The substrate can include a second beveled overburden that includes a second outer edge that forms a second bevel angle greater than 95° with the second surface. Methods of making the beveled overburdens are also disclosed.Type: GrantFiled: April 29, 2021Date of Patent: January 21, 2025Assignee: Corning IncorporatedInventors: Dhananjay Joshi, Chukwudi Azubuike Okoro, Scott Christopher Pollard
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Publication number: 20240413070Abstract: A via includes a substrate and a porous electrically conductive material. The substrate includes a first surface and a second surface opposite to the first surface. The substrate includes a through-hole extending from the first surface to the second surface. The porous electrically conductive material extends through the through-hole. The porous electrically conductive material includes a first porosity in a central region of the through-hole and a second porosity less than the first porosity proximate the first surface and the second surface of the substrate.Type: ApplicationFiled: September 28, 2022Publication date: December 12, 2024Inventors: Sean Matthew Garner, Dhananjay Joshi, Chukwudi Azubuike Okoro
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Patent number: 12071364Abstract: A glass ceramic article including a lithium disilicate crystalline phase, a petalite crystalline phased, and a residual glass phase. The glass ceramic article has a warp (?m)<(3.65×10?9/?m×diagonal2) where diagonal is a diagonal measurement of the glass ceramic article in ?m, a stress of less than 30 nm of retardation per mm of glass ceramic article thickness, a haze (%)<0.0994t+0.12 where t is the thickness of the glass ceramic article in mm, and an optical transmission (%)>0.91×10(2-0.03t) of electromagnetic radiation wavelengths from 450 nm to 800 nm, where t is the thickness of the glass ceramic article in mm.Type: GrantFiled: April 11, 2023Date of Patent: August 27, 2024Assignee: CORNING INCORPORATEDInventors: Carol Ann Click, James Howard Edmonston, Qiang Fu, Jill Marie Hall, Mathieu Gerard Jacques Hubert, Dhananjay Joshi, Andrew Peter Kittleson, Katherine Weber Kroemer, Galan Gregory Moore, Rohit Rai, John Richard Ridge, John Robert Saltzer, Jr., Charlene Marie Smith, Erika Lynn Stapleton, Matthew Daniel Trosa, Ljerka Ukrainczyk, Shelby Kerin Wilson, Bin Yang, Zheming Zheng
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Publication number: 20230380062Abstract: A substrate including a via with a beveled overburden is disclosed. The substrate can include a substrate having a first surface, a second surface opposite the first surface, and a via passing from the first surface to the second surface. The via can be coated with a metallic layer that includes a first beveled overburden on the first surface, and the first beveled overburden can include a first outer edge that forms a first bevel angle greater than 95° with the first surface. The substrate can include a second beveled overburden that includes a second outer edge that forms a second bevel angle greater than 95° with the second surface. Methods of making the beveled overburdens are also disclosed.Type: ApplicationFiled: April 29, 2021Publication date: November 23, 2023Inventors: DHANANJAY JOSHI, CHUKWUDI AZUBUIKE OKORO, SCOTT CHRISTOPHER POLLARD
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Publication number: 20230242438Abstract: A glass ceramic article including a lithium disilicate crystalline phase, a petalite crystalline phased, and a residual glass phase. The glass ceramic article has a warp (?m)<(3.65×10?9/?m×diagonal2) where diagonal is a diagonal measurement of the glass ceramic article in ?m, a stress of less than 30 nm of retardation per mm of glass ceramic article thickness, a haze (%)<0.0994t+0.12 where t is the thickness of the glass ceramic article in mm, and an optical transmission (%)>0.91×10(2-0.03t) of electromagnetic radiation wavelengths from 450 nm to 800 nm, where t is the thickness of the glass ceramic article in mm.Type: ApplicationFiled: April 11, 2023Publication date: August 3, 2023Inventors: Carol Ann Click, James Howard Edmonston, Qiang Fu, Jill Marie Hall, Mathieu Gerard Jacques Hubert, Dhananjay Joshi, Andrew Peter Kittleson, Katherine Weber Kroemer, Galan Gregory Moore, Rohit Rai, John Richard Ridge, John Robert Saltzer, JR., Charlene Marie Smith, Erika Lynn Stapleton, Matthew Daniel Trosa, Ljerka Ukrainczyk, Shelby Kerin Wilson, Bin Yang, Zheming Zheng
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Publication number: 20230185603Abstract: Methods and apparatus relating to dynamic capability discovery and enforcement for accelerators and devices in multi-tenant systems are described. In an embodiment, a hardware accelerator device advertises one or more available operations and/or capabilities of the hardware accelerator device to one or more tenants. Logic circuitry controls access to the one or more available operations and/or capabilities of the one or more work queues on a per-tenant basis. Other embodiments are also disclosed and claimed.Type: ApplicationFiled: December 14, 2021Publication date: June 15, 2023Applicant: Intel CorporationInventors: Saurabh Gayen, Philip Lantz, Narayan Ranganathan, Dhananjay Joshi, Rajesh Sankaran, Utkarsh Kakaiya
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Patent number: 11649187Abstract: A glass ceramic article including a lithium disilicate crystalline phase, a petalite crystalline phased, and a residual glass phase. The glass ceramic article has a warp (?m)<(3.65×10?9/?m×diagonal2) where diagonal is a diagonal measurement of the glass ceramic article in ?m, a stress of less than 30 nm of retardation per mm of glass ceramic article thickness, a haze (%)<0.0994t+0.12 where t is the thickness of the glass ceramic article in mm, and an optical transmission (%)>0.91×10(2?0.03t) of electromagnetic radiation wavelengths from 450 nm to 800 nm, where t is the thickness of the glass ceramic article in mm.Type: GrantFiled: April 22, 2021Date of Patent: May 16, 2023Assignee: CORNING INCORPORATEDInventors: Carol Ann Click, James Howard Edmonston, Qiang Fu, Jill Marie Hall, Mathieu Gerard Jacques Hubert, Dhananjay Joshi, Andrew Peter Kittleson, Katherine Weber Kroemer, Galan Gregory Moore, Rohit Rai, John Richard Ridge, John Robert Saltzer, Jr., Charlene Marie Smith, Erika Lynn Stapleton, Matthew Daniel Trosa, Ljerka Ukrainczyk, Shelby Kerin Wilson, Bin Yang, Zheming Zheng