Patents by Inventor Dhananjay Pai

Dhananjay Pai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Layer-wise agglomerated urea granules
    Patent number: 11021410
    Abstract: The present disclosure generally relates to layer-wise agglomerated controlled release granular urea composition and methods of making and using the layer-wise agglomerated controlled release granular urea composition. In a particular composition, the water-soluble plant nutrient comprises urea, the binding material for the core comprises corn starch, the hydrogel for the coating layer comprises corn starch hydrogel, the core has a thickness of 2.5-3.5 mm and a closed porosity of 0.05-3%, and the coating layer has a thickness of 1.35-1.5 mm and a closed porosity of 0.1-5%.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: June 1, 2021
    Assignee: Purdue Research Foundation
    Inventors: Rose Prabin Kingsly Ambrose, Carl R Wassgren, Jr., Dhananjay Pai, Yanjie Chen
  • LAYER-WISE AGGLOMERATED UREA GRANULES
    Publication number: 20200181035
    Abstract: The present disclosure generally relates to layer-wise agglomerated controlled release granular urea composition and methods of making and using the layer-wise agglomerated controlled release granular urea composition. In a particular composition, the water-soluble plant nutrient comprises urea, the binding material for the core comprises corn starch, the hydrogel for the coating layer comprises corn starch hydrogel, the core has a thickness of 2.5-3.5 mm and a closed porosity of 0.05-3%, and the coating layer has a thickness of 1.35-1.5 mm and a closed porosity of 0.1-5%.
    Type: Application
    Filed: December 5, 2019
    Publication date: June 11, 2020
    Applicant: Purdue Research Foundation
    Inventors: Rose Prabin Kingsly Ambrose, Carl R Wassgren, JR., Dhananjay Pai, Yanjie Chen